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NTMFD4C85NT3G

Onsemi

NTMFD4C85NT3G by Onsemi

NTMFD4C85NT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 300A IDM, and 0.0043 ohm RDS(ON). It is used for SWITCHING applications in SERIES CONNECTED configuration. The transistor features METAL-OXIDE SEMICONDUCTOR technology and comes in an 8-terminal SMALL OUTLINE package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,018 parts In-Stock

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Digiode

USA . 2,381 parts In-Stock

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AZTECH Wire

Italy . 164 parts In-Stock

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$15.360

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Ampacity Inc.

Singapore . 294 parts In-Stock

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$39.050

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Kepictronics

USA . 14,991 parts In-Stock

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Problanco Electronics

Mexico . 6,477 parts In-Stock

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Kulean Microsystems

USA . 2,914 parts In-Stock

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SupplyDigital Components

Austria . 1,838 parts In-Stock

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TANS Electronics

Latvia . 1,416 parts In-Stock

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Corphita

USA . 610 parts In-Stock

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UHIMA Technologies

Türkiye . 517 parts In-Stock

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Corohmni

South Africa . 440 parts In-Stock

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Overview

Experience the unrivaled performance of the NTMFD4C85NT3G by Onsemi, a top-tier manufacturer known for delivering superior quality power Field Effect Transistors (FET). This N-channel transistor with series connected elements and built-in diode is ideal for various switching applications. With a high maximum pulsed drain current of 300 A and low drain-source on resistance of 0.0043 ohm, this transistor offers unmatched reliability and efficiency. Upgrade your electronic devices with the NTMFD4C85NT3G to enjoy enhanced performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good insulation properties and is cost-effective, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds compared to P-channel FETs, making them efficient for power switching applications.

Minimum DS Breakdown Voltage: 30 V

Relatively high breakdown voltage ensures the FET can handle higher voltages without breakdown, increasing reliability in high-power applications.

Maximum Pulsed Drain Current (IDM): 300 A

High pulsed drain current capability allows the FET to handle large current spikes without damage, making it suitable for high-power switching applications.

Maximum Drain-Source On Resistance: 0.0043 ohm

Low ON-resistance results in minimal power loss and higher efficiency during switching operations, making the FET suitable for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFD4C85NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

34.5 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

15.4 A

Maximum Drain-Source On Resistance:

.0043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

300 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFD4C85NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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