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NTLJS3180PZTBG

Onsemi

NTLJS3180PZTBG by Onsemi

NTLJS3180PZTBG by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage and 3.5A ID. Ideal for SWITCHING applications, it features 0.05 ohm RDS(ON) and ENHANCEMENT MODE operation. This SMALL OUTLINE transistor has 6 terminals, METAL-OXIDE SEMICONDUCTOR tech, and DUAL terminal position.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

3,000

-

$0.238

$0.197

$0.176

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.300

3,000

-

-

-

$0.300

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

3,000

-

-

-

$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,016 parts In-Stock

1+ parts

$0.155

100+ parts

-

1k+ parts

-

10k+ parts

-

1,016

$0.155

-

-

-

Digiode

USA . 95 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

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10k+ parts

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95

$0.185

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 475 parts In-Stock

1+ parts

$0.155

100+ parts

-

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-

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475

$0.155

-

-

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Corphita

USA . 2,321 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

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2,321

$0.176

-

-

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Component Stockers USA

USA . 3,657 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

-

3,657

$0.200

$0.190

$0.170

-

SupplyDigital Components

Austria . 6,935 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,935

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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TANS Electronics

Latvia . 4,437 parts In-Stock

1+ parts

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4,437

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Problanco Electronics

Mexico . 3,512 parts In-Stock

1+ parts

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100+ parts

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3,512

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.155

10k+ parts

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3,000

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-

$0.155

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Kulean Microsystems

USA . 2,162 parts In-Stock

1+ parts

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2,162

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UHIMA Technologies

Türkiye . 176 parts In-Stock

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176

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Overview

Upgrade your electronics with the NTLJS3180PZTBG by Onsemi, a top-quality P-CHANNEL Small Signal Field Effect Transistor designed for switching applications. Manufactured with precision and expertise, this transistor offers superior performance and reliability. Its compact size and surface mount capabilities make it ideal for a wide range of electronic devices. Experience the value and benefits of this product, from its enhanced efficiency to its seamless integration. Trust Onsemi for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where P-channel transistors are required, offering versatility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by including a built-in diode, reducing the need for additional components.

Transistor Application: SWITCHING

Specifically designed for switching applications, providing efficient control over the flow of current.

Surface Mount: YES

Allows for easy and convenient installation on surface-mounted PCBs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 20 V

Can handle high voltages up to 20V, making it suitable for a wide range of applications.

Package Shape: SQUARE

Compact square shape allows for efficient use of space on the PCB, ideal for applications with limited area.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly manufacturing and compliance with regulations.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control over the transistor's behavior, ensuring reliable performance.

No. of Terminals: 6

Provides multiple connection points for versatile circuit design and integration.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on the PCB, ideal for miniaturized electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for enhanced performance and efficiency in switching applications.

Transistor Element Material: SILICON

Uses high-quality silicon material for reliable and consistent performance over time.

Terminal Finish: TIN

Tin terminal finish for improved solderability and conductivity in circuit connections.

Maximum Drain Current (ID): 3.5 A

Capable of handling high drain currents up to 3.5A, suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.05 ohm

Low on-resistance of 0.05 ohm reduces power losses and improves efficiency in switching operations.

Terminal Position: DUAL

Dual terminal position for versatile mounting options and flexible circuit layouts.

Case Connection: DRAIN

Drain case connection for efficient dissipation of heat, ensuring stable operation under high load conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTLJS3180PZTBG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLJS3180PZTBG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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