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NTHS2101PT1

Onsemi

NTHS2101PT1 by Onsemi

NTHS2101PT1 by Onsemi is a P-CHANNEL FET for SWITCHING applications. It features 8V DS Breakdown Voltage, 5.4A Drain Current, and 0.025 ohm On Resistance. With ENHANCEMENT MODE operation, this transistor has a max power dissipation of 1.3W in a SMALL OUTLINE package style.

Median Price

$0.185

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 574,177 parts In-Stock

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-

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$0.185

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$0.153

10k+ parts

$0.137

574,177

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$0.185

$0.153

$0.137

DigiKey

USA . 574,177 parts In-Stock

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$0.230

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$0.230

Verical

USA . 566,475 parts In-Stock

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$0.171

566,475

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$0.171

Distributors (In-Stock)

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Digiode

USA . 288 parts In-Stock

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$0.144

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288

$0.144

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Chip Stock

USA . 58,000 parts In-Stock

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Vyrian

USA . 11,585 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 2,925 parts In-Stock

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2,925

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NPI Materials, Inc.

USA . 796 parts In-Stock

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796

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Distributors (Availability)

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Ampacity Inc.

Singapore . 630,868 parts In-Stock

1+ parts

$0.129

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630,868

$0.129

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Corphita

USA . 107 parts In-Stock

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$0.137

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107

$0.137

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Corohmni

South Africa . 120 parts In-Stock

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$0.152

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$0.152

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AZTECH Wire

Italy . 98 parts In-Stock

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$20.000

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98

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Continental Prestige Electronics

USA . 681,279 parts In-Stock

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$0.139

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Perfect Parts

USA . 26,425 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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Kulean Microsystems

USA . 5,255 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,793 parts In-Stock

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TANS Electronics

Latvia . 4,553 parts In-Stock

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RC Electronics

USA . 3,000 parts In-Stock

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Assy Fe

Spain . 2,925 parts In-Stock

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Problanco Electronics

Mexico . 2,907 parts In-Stock

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SupplyDigital Components

Austria . 742 parts In-Stock

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Futuretech Components

Singapore . 508 parts In-Stock

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UHIMA Technologies

Türkiye . 344 parts In-Stock

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Overview

Discover the NTHS2101PT1 by Onsemi, a top-quality P-CHANNEL Power Field Effect Transistor with a single configuration and built-in diode. Ideal for switching applications, this transistor offers enhanced performance and reliability. With a maximum pulsing drain current of 7.5A and a low on-resistance of 0.025 ohm, this transistor delivers exceptional power dissipation of 1.3W. Trust the industry-leading manufacturer Onsemi to provide cutting-edge technology and superior materials, ensuring long-lasting durability and efficiency. Elevate your electronics projects with the NTHS2101PT1 and experience the convenience and value it brings to your designs.

Feature Benefit Bullets

Polarity or Channel Type

P-CHANNEL type ensures efficient power management and allows for easy integration into existing circuit designs.

Configuration

SINGLE WITH BUILT-IN DIODE configuration enables simplified circuit design and offers protection against reverse voltage.

Transistor Application

Designed for SWITCHING applications, ensuring fast and efficient operation in various power management scenarios.

Surface Mount

Surface mount capability allows for easy and convenient PCB assembly, saving time and effort during manufacturing.

Minimum DS Breakdown Voltage

With a minimum 8V breakdown voltage, this FET offers reliable protection against voltage spikes and overloads.

Package Shape

RECTANGULAR shape provides compact and space-saving design possibilities for versatile application in electronics.

Maximum Pulsed Drain Current (IDM)

High maximum pulsed drain current of 7.5A allows for handling sudden surge currents and peak power demands.

Maximum Drain Current (Abs) (ID)

With a maximum drain current of 5.4A, this FET can efficiently handle continuous current flow in various circuit configurations.

Maximum Power Dissipation (Abs)

1.3W maximum power dissipation ensures reliable performance and long-term durability under demanding operating conditions.

Package Style (Meter)

SMALL OUTLINE package style offers compatibility with standard assembly processes and facilitates seamless integration into electronic devices.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR technology provides efficient power switching capabilities and enhances overall performance of the FET.

Transistor Element Material

SILICON material ensures reliability, durability, and high performance in various temperature and voltage conditions.

Terminal Finish

TIN LEAD terminal finish offers reliable electrical connections and ensures long-lasting performance in different operating environments.

Maximum Drain-Source On Resistance

Low maximum drain-source on resistance of 0.025 ohm minimizes power loss and improves efficiency in power management applications.

Terminal Position

DUAL terminal position allows for flexible PCB layout and facilitates easy connections in complex electronic circuits.

Peak Reflow Temperature °C

With a peak reflow temperature of 235°C, this FET can withstand high-temperature soldering processes without compromising its performance or longevity.

Technical Specifications

Power Field Effect Transistors (FET) NTHS2101PT1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (Abs) (ID):

5.4 A

Maximum Drain Current (ID):

5.4 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

7.5 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHS2101PT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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