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NTHS2101PT1G

Onsemi

NTHS2101PT1G by Onsemi

NTHS2101PT1G by Onsemi is a P-CHANNEL FET for SWITCHING applications. Features include 8V DS Breakdown Voltage, 5.4A Drain Current, and 0.025 ohm On Resistance. Ideal for power management in compact devices due to its small outline package and high power dissipation capability of 1.3W.

Median Price

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PC Components Company LLC

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Bristol Electronics

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Digiode

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Semi Source

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Prism Electronics

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AZTECH Wire

Italy . 309 parts In-Stock

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RC Electronics

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Overview

Discover the power of the NTHS2101PT1G by Onsemi, a top-quality P-CHANNEL power field effect transistor with built-in diode for enhanced performance. Ideal for switching applications, this transistor offers reliable and efficient operation. With Onsemi's reputation for excellence in semiconductor technology, you can trust in the durability and precision of this product. Elevate your projects with the NTHS2101PT1G's high power dissipation capacity and low drain-source resistance. Upgrade to superior performance today!

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL FETs are known for their lower ON resistance, making them suitable for applications where low power dissipation is important.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy implementation of reverse polarity protection, adding to the product's reliability.

Transistor Application: SWITCHING

Ideal for switching applications due to its fast response time and low power dissipation characteristics.

Minimum DS Breakdown Voltage: 8 V

Higher breakdown voltage provides reliability and protection against voltage spikes in the circuit.

Maximum Power Dissipation (Abs): 1.3 W

With a high power dissipation rating, this FET can handle higher loads without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Improved efficiency and performance compared to other transistor technologies.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for a short duration, ensuring reliability during manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NTHS2101PT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (Abs) (ID):

5.4 A

Maximum Drain Current (ID):

5.4 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

7.5 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHS2101PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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