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NTHS4101PT1G

Onsemi

NTHS4101PT1G by Onsemi

NTHS4101PT1G by Onsemi is a P-CHANNEL FET for switching applications. Features include 20V DS breakdown voltage, 4.8A max drain current, and 0.034 ohm max on resistance. Ideal for enhancement mode operation in small outline packages with matte tin finish.

Median Price

$0.618

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,695 parts In-Stock

1+ parts

$0.458

100+ parts

$0.430

1k+ parts

$0.392

10k+ parts

$0.351

2,695

$0.458

$0.430

$0.392

$0.351

Element14

Singapore . 8,315 parts In-Stock

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$0.618

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8,315

$0.618

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Newark

USA . 8,269 parts In-Stock

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$0.742

100+ parts

$0.563

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$0.471

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8,269

$0.742

$0.563

$0.471

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Arrow

USA . 2,695 parts In-Stock

1+ parts

$1.112

100+ parts

$0.642

1k+ parts

$0.461

10k+ parts

$0.396

2,695

$1.112

$0.642

$0.461

$0.396

Mouser Electronics

USA . 8,107 parts In-Stock

1+ parts

$1.470

100+ parts

$0.478

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$0.443

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8,107

$1.470

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DigiKey

USA . 7,781 parts In-Stock

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$1.720

100+ parts

$0.726

1k+ parts

$0.521

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7,781

$1.720

$0.726

$0.521

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Rochester

USA . 31,442 parts In-Stock

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$0.526

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$0.437

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$0.390

31,442

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$0.526

$0.437

$0.390

Verical

USA . 31,442 parts In-Stock

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$0.546

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$0.487

31,442

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$0.487

Farnell

UK . 8,335 parts In-Stock

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$0.598

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$0.433

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$0.375

8,335

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$0.598

$0.433

$0.375

Distributors (In-Stock)

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Digiode

USA . 1,215 parts In-Stock

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$0.295

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$0.295

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Nova Conductors

Japan . 50 parts In-Stock

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$0.663

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50

$0.663

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Chip Stock

USA . 43,000 parts In-Stock

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Vyrian

USA . 10,674 parts In-Stock

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Cyclops Electronics Ltd

UK . 8,438 parts In-Stock

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Flip Electronics

USA . 6,000 parts In-Stock

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ComSIT USA

USA . 1,260 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,260 parts In-Stock

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BCID Electronics Ltd.

Israel . 194 parts In-Stock

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Electronics Depot

USA . 120 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,526 parts In-Stock

1+ parts

$0.280

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1,526

$0.280

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Semicontronic

India . 10,896 parts In-Stock

1+ parts

$0.282

100+ parts

$0.275

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$0.274

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10,896

$0.282

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Ampacity Inc.

Singapore . 10,653 parts In-Stock

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$0.282

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$0.282

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Corohmni

South Africa . 210 parts In-Stock

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$0.307

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$0.307

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Argo Parts USA

USA . 3,907 parts In-Stock

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$0.663

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$0.643

3,907

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$0.643

Continental Prestige Electronics

USA . 8,089 parts In-Stock

1+ parts

$0.989

100+ parts

$0.594

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$0.393

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8,089

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Aztec Data Supply Inc.

USA . 2,346 parts In-Stock

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$1.020

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Perfect Parts

USA . 171,359 parts In-Stock

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RC Electronics

USA . 99,458 parts In-Stock

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Kepictronics

USA . 21,000 parts In-Stock

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GreenTree Electronics

Israel . 10,295 parts In-Stock

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Lixinc

USA . 9,544 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,555 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,533 parts In-Stock

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Problanco Electronics

Mexico . 4,271 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,940 parts In-Stock

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SupplyDigital Components

Austria . 2,369 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.650

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$0.630

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$0.617

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$0.617

UHIMA Technologies

Türkiye . 393 parts In-Stock

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Kulean Microsystems

USA . 255 parts In-Stock

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Overview

Discover the superior performance and reliability of the NTHS4101PT1G by Onsemi, a top-of-the-line P-CHANNEL Power Field Effect Transistor with a built-in diode. Ideal for switching applications, this transistor offers unmatched efficiency and precision. With a maximum drain current of 4.8 A and low on-resistance of 0.034 ohm, it delivers exceptional power handling capabilities. Trust in Onsemi's reputation for quality and innovation, and elevate your electronic designs with the NTHS4101PT1G. Experience the benefits of enhanced functionality and seamless operation that this cutting-edge component brings to your projects.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs can provide lower ON resistance and higher current carrying capability compared to N-channel FETs, making them suitable for certain applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from voltage spikes and reverse voltage, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance.

Surface Mount: YES

Surface mount package allows for easy and compact PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 20 V

A higher breakdown voltage ensures the FET can withstand higher voltages, making it suitable for a wide range of applications.

Maximum Drain Current (ID): 4.8 A

With a high maximum drain current rating, this FET can handle high currents without overheating or failing.

Maximum Power Dissipation (Abs): 2.5 W

The FET's high power dissipation capability allows it to operate reliably under load without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, low gate drive requirements, and fast switching speeds.

Technical Specifications

Power Field Effect Transistors (FET) NTHS4101PT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

4.8 A

Maximum Drain Current (ID):

4.8 A

Maximum Drain-Source On Resistance:

.034 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

190 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHS4101PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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