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NTHLD040N65S3HF

Onsemi

NTHLD040N65S3HF by Onsemi

NTHLD040N65S3HF by Onsemi is a Power FET with 650V DS Breakdown Voltage, 162.5A IDM, and 0.04 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max temp of 150 °C. The transistor features a SINGLE configuration with BUILT-IN DIODE and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$10.946

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 30 parts In-Stock

1+ parts

$8.710

100+ parts

$6.200

1k+ parts

-

10k+ parts

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30

$8.710

$6.200

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DigiKey

USA . 16,258 parts In-Stock

1+ parts

-

100+ parts

$12.750

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$12.750

10k+ parts

$12.750

16,258

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$12.750

$12.750

$12.750

Flip Electronics (Authorized)

USA . 16,258 parts In-Stock

1+ parts

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16,258

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Rochester

USA . 9,962 parts In-Stock

1+ parts

-

100+ parts

$9.730

1k+ parts

$8.700

10k+ parts

$8.190

9,962

-

$9.730

$8.700

$8.190

Verical

USA . 9,122 parts In-Stock

1+ parts

-

100+ parts

$12.162

1k+ parts

$10.875

10k+ parts

$10.238

9,122

-

$12.162

$10.875

$10.238

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,322 parts In-Stock

1+ parts

$8.274

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-

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2,322

$8.274

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Vyrian

USA . 479 parts In-Stock

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$8.710

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479

$8.710

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Flip Electronics

USA . 16,258 parts In-Stock

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16,258

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Distributors (Availability)

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Corphita

USA . 379 parts In-Stock

1+ parts

$7.839

100+ parts

-

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379

$7.839

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Continental Prestige Electronics

USA . 10 parts In-Stock

1+ parts

$8.360

100+ parts

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10

$8.360

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Corohmni

South Africa . 123 parts In-Stock

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$8.710

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123

$8.710

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Microchip USA

USA . 2,279 parts In-Stock

1+ parts

$48.636

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2,279

$48.636

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TANS Electronics

Latvia . 1,659 parts In-Stock

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1,659

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Perfect Parts

USA . 1,344 parts In-Stock

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Kulean Microsystems

USA . 1,324 parts In-Stock

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1,324

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Problanco Electronics

Mexico . 1,220 parts In-Stock

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SupplyDigital Components

Austria . 820 parts In-Stock

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820

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UHIMA Technologies

Türkiye . 182 parts In-Stock

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182

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GreenTree Electronics

Israel . 160 parts In-Stock

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160

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Authorized Procurement Solutions

USA . 60 parts In-Stock

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60

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Overview

Elevate your power management solutions with the NTHLD040N65S3HF by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor offers unparalleled quality and reliability. Ideal for switching applications, this N-CHANNEL transistor boasts a maximum drain current of 65 A and a breakthrough voltage of 650 V. With a robust construction and enhanced performance, this transistor ensures seamless operation even in challenging conditions. Experience the value and benefits of superior power management with the NTHLD040N65S3HF by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good insulation for the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better efficiency and higher current carrying capacity than P-channel FETs, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient reverse current protection and simplifies circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation in such scenarios.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage circuits safely.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong mechanical connection, ideal for applications where vibration or mechanical stress is a concern.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and higher efficiency compared to depletion mode FETs.

Maximum Pulsed Drain Current (IDM): 162.5 A

High pulsed drain current rating allows for handling short bursts of high current, suitable for demanding applications.

Avalanche Energy Rating (EAS): 1009 mJ

High avalanche energy rating indicates the FET can withstand voltage spikes or surges without damage.

Maximum Drain Current (Abs) (ID): 65 A

A high drain current rating ensures the FET can handle high continuous current without overheating.

No. of Terminals: 3

Sufficient terminals for connecting the FET in a circuit while keeping the design simple.

Maximum Power Dissipation (Abs): 446 W

High power dissipation capability allows the FET to handle high power levels without thermal issues.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers easy mounting and heat dissipation, suitable for high power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides fast switching speeds and low on-state resistance, contributing to high efficiency.

Maximum Operating Temperature: 150 °C

High operating temperature rating allows the FET to operate reliably in harsh environments with elevated temperatures.

Transistor Element Material: SILICON

Silicon-based FETs offer good performance characteristics and reliability for a wide range of applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the FET can perform in cold environments without issues.

Terminal Finish: MATTE TIN

Matte tin finish provides a reliable connection and is resistant to corrosion, ensuring long-term performance.

Maximum Drain Current (ID): 65 A

High drain current rating allows the FET to handle large continuous currents without overheating.

Maximum Drain-Source On Resistance: 0.04 ohm

Low on-state resistance minimizes power losses and heat generation, enhancing efficiency.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and connections, making installation easier.

Technical Specifications

Power Field Effect Transistors (FET) NTHLD040N65S3HF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1009 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

162.5 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHLD040N65S3HF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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