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NTHD4401PT1

Onsemi

NTHD4401PT1 by Onsemi

NTHD4401PT1 by Onsemi is a P-CHANNEL FET with 2 elements & built-in diode, ideal for switching applications. Features include: Max Drain Current of 2.1A, Breakdown Voltage of 20V, and Operating Temp up to 150 °C. Its small outline package makes it suitable for surface mount designs.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

3,000

-

$0.159

$0.132

$0.117

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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$0.200

3,000

-

-

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$0.200

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.147

3,000

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-

-

$0.147

Distributors (In-Stock)

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Digiode

USA . 424 parts In-Stock

1+ parts

$0.124

100+ parts

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424

$0.124

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Vyrian

USA . 11,350 parts In-Stock

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11,350

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,858 parts In-Stock

1+ parts

$0.111

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-

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2,858

$0.111

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Corphita

USA . 335 parts In-Stock

1+ parts

$0.117

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335

$0.117

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Corohmni

South Africa . 213 parts In-Stock

1+ parts

$0.130

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213

$0.130

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AZTECH Wire

Italy . 1,160 parts In-Stock

1+ parts

$19.290

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1,160

$19.290

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QUARKTWIN TECHNOLOGY LTD

USA . 19,310 parts In-Stock

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19,310

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Kulean Microsystems

USA . 5,302 parts In-Stock

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5,302

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Problanco Electronics

Mexico . 4,161 parts In-Stock

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SupplyDigital Components

Austria . 3,732 parts In-Stock

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3,732

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

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$0.119

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3,000

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$0.119

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TANS Electronics

Latvia . 2,849 parts In-Stock

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2,849

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UHIMA Technologies

Türkiye . 972 parts In-Stock

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972

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Overview

Enhance your electronic designs with the NTHD4401PT1 by Onsemi, a high-quality P-CHANNEL small signal field effect transistor perfect for switching applications. With its built-in diode and dual elements, this transistor offers superior performance and reliability. Whether you're working on power management or signal amplification, this transistor delivers impressive results. Trust Onsemi's expertise in semiconductor technology to bring you cutting-edge solutions for your projects. Upgrade your circuits today with the NTHD4401PT1 and experience the difference in efficiency and functionality.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high current-handling capabilities and low on-state resistance, making them suitable for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having two separate elements with a built-in diode allows for more efficient and flexible circuit designs, providing better performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high-speed switching and low power consumption.

Surface Mount: YES

Surface mount technology offers space-saving advantages and allows for automated assembly, making it suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle higher voltages without breakdown, providing reliability in various applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration in circuit boards and provides a compact form factor for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance, low output impedance, and improved switching speed, making them ideal for high-performance switching circuits.

Maximum Drain Current (Abs) (ID): 2.1 A

With a high maximum drain current of 2.1A, this FET can handle large currents, making it suitable for high-power applications.

No. of Terminals: 8

Having 8 terminals allows for more connections and flexibility in circuit designs, enabling complex switching applications.

Maximum Power Dissipation (Abs): 1.1 W

With a maximum power dissipation of 1.1W, this FET can handle high power levels efficiently, ensuring reliable performance under various operating conditions.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards and provides thermal efficiency for better heat dissipation, enhancing overall product reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high-performance characteristics, such as low leakage current and high switching speeds, making it suitable for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this FET can withstand elevated temperatures, ensuring reliable performance in harsh environments.

Transistor Element Material: SILICON

Silicon-based FETs offer high temperature stability, low leakage current, and excellent reliability, making them suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and ensures reliable electrical connections, enhancing the overall durability of the product.

Maximum Drain-Source On Resistance: 0.155 ohm

With a low drain-source on resistance of 0.155 ohms, this FET minimizes power losses and improves efficiency in switching applications.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and facilitates easy connections in circuit designs, enhancing overall flexibility.

Peak Reflow Temperature °C: 235

Having a peak reflow temperature of 235 °C ensures proper soldering and reliable connections during the manufacturing process, leading to high-quality end products.

Maximum Feedback Capacitance (Crss): 50 pF

Low feedback capacitance of 50pF minimizes feedback effects in high-frequency applications, ensuring stable and accurate performance in switching circuits.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTHD4401PT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2.1 A

Maximum Drain Current (ID):

2.1 A

Maximum Drain-Source On Resistance:

.155 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

50 pF

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHD4401PT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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