Loading...

NTHD5904NT3G

Onsemi

NTHD5904NT3G by Onsemi

NTHD5904NT3G by Onsemi is a N-CHANNEL FET with 2 elements & built-in diode. It has a max drain current of 3.3A, on-resistance of 0.065 ohm, and operates in enhancement mode for switching applications. This small outline transistor can handle up to 1.13W power dissipation at a max temp of 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,415

-

-

-

-

Digiode

USA . 891 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

891

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 412 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

412

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,278 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,278

-

-

-

-

Perfect Parts

USA . 22,672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,672

-

-

-

-

TANS Electronics

Latvia . 8,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,070

-

-

-

-

Kulean Microsystems

USA . 6,381 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,381

-

-

-

-

Problanco Electronics

Mexico . 3,066 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,066

-

-

-

-

Corphita

USA . 927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

927

-

-

-

-

UHIMA Technologies

Türkiye . 738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

738

-

-

-

-

SupplyDigital Components

Austria . 530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

530

-

-

-

-

Corohmni

South Africa . 413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

413

-

-

-

-

Overview

Unlock the power of innovation with the NTHD5904NT3G by Onsemi. Crafted with precision and expertise, this Small Signal Field Effect Transistor (FET) offers unmatched quality and reliability for your switching applications. With a maximum drain current of 3.3A and a minimum DS breakdown voltage of 20V, this N-CHANNEL transistor is designed to exceed expectations. Embrace seamless operation and enhanced performance with this cutting-edge technology. Elevate your projects with the NTHD5904NT3G and experience the difference today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are known for their high efficiency and fast switching speeds, making them ideal for applications requiring high performance.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages, making it suitable for a variety of applications.

Maximum Drain Current (Abs) (ID): 3.3 A

The high maximum drain current of 3.3A allows this transistor to handle large current loads, making it suitable for power-hungry applications.

Maximum Power Dissipation (Abs): 1.13 W

With a maximum power dissipation of 1.13W, this transistor can handle moderate power levels without overheating.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures that this transistor can operate reliably in a wide range of environmental conditions.

Maximum Drain-Source On Resistance: 0.065 ohm

The low drain-source on resistance of 0.065 ohm results in minimal power loss and improved efficiency in switch mode applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTHD5904NT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.3 A

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHD5904NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19