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NTF3055L175T3

Onsemi

NTF3055L175T3 by Onsemi

NTF3055L175T3 by Onsemi is a Power FET with 60V DS Breakdown Voltage, 6A IDM, and 0.175 ohm RDS(on). Ideal for switching applications, it features an Enhancement Mode in a small outline package with Gull Wing terminals. Operating at up to 175 °C, it has a built-in diode and can handle 65mJ EAS.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,503 parts In-Stock

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Digiode

USA . 1,566 parts In-Stock

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AZTECH Wire

Italy . 754 parts In-Stock

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$12.640

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754

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Kulean Microsystems

USA . 8,388 parts In-Stock

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SupplyDigital Components

Austria . 5,999 parts In-Stock

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TANS Electronics

Latvia . 4,903 parts In-Stock

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Corphita

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Problanco Electronics

Mexico . 331 parts In-Stock

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Corohmni

South Africa . 303 parts In-Stock

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UHIMA Technologies

Türkiye . 31 parts In-Stock

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Overview

Experience the power of innovation with the NTF3055L175T3 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed for switching applications with precision and reliability. The NTF3055L175T3, with its N-CHANNEL configuration and built-in diode, offers unparalleled performance and efficiency. Whether you're in need of enhanced power management or improved circuit control, this transistor provides a solution that exceeds expectations. Trust Onsemi to deliver cutting-edge technology that empowers your projects and pushes boundaries.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and can handle reverse current flow effectively.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Enables easy installation and integration onto circuit boards.

Minimum DS Breakdown Voltage: 60 V

Provides a high breakdown voltage, offering protection against voltage spikes.

Terminal Form: GULL WING

Facilitates easy soldering and connection processes.

Maximum Pulsed Drain Current (IDM): 6 A

Capable of handling high current pulses for efficient switching operations.

Avalanche Energy Rating (EAS): 65 mJ

Withstands energy spikes and ensures reliability in demanding environments.

Maximum Drain Current (Abs) (ID): 2 A

Can handle moderate continuous current flow without overheating.

Maximum Power Dissipation (Abs): 1.3 W

Efficiently dissipates heat to prevent overheating and ensure long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced technology for improved performance and efficiency.

Maximum Operating Temperature: 175 °C

Operates effectively in high-temperature environments without compromising performance.

Transistor Element Material: SILICON

Provides reliability and stability for long-term usage.

Terminal Finish: TIN LEAD

Ensures good electrical conductivity and solderability for secure connections.

Maximum Drain-Source On Resistance: 0.175 ohm

Offers low resistance for efficient current flow and minimal power loss.

Terminal Position: DUAL

Provides flexibility in circuit connections and layouts.

Case Connection: DRAIN

Allows for easy connection to the drain terminal for effective current flow.

Peak Reflow Temperature °C: 235

Can withstand high-temperature reflow soldering processes for secure connections.

Technical Specifications

Power Field Effect Transistors (FET) NTF3055L175T3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.175 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF3055L175T3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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