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NTF3055-160T3LF

Onsemi

NTF3055-160T3LF by Onsemi

NTF3055-160T3LF by Onsemi is a Power FET with 60V DS Breakdown Voltage, 6A IDM, and 0.16 ohm RDS(on). Ideal for SWITCHING applications, it features an ENHANCEMENT MODE operation in a SMALL OUTLINE package with GULL WING terminals. Operating up to 175 °C, it offers a peak reflow temperature of 235°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 3,900 parts In-Stock

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Vyrian

USA . 3,046 parts In-Stock

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Digiode

USA . 2,435 parts In-Stock

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AZTECH Wire

Italy . 107 parts In-Stock

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$12.370

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TANS Electronics

Latvia . 6,935 parts In-Stock

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Problanco Electronics

Mexico . 6,362 parts In-Stock

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SupplyDigital Components

Austria . 3,204 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 978 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 582 parts In-Stock

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Corohmni

South Africa . 352 parts In-Stock

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor (FET)? Look no further than the NTF3055-160T3LF by Onsemi! With its N-channel configuration, built-in diode, and switching application, this transistor is perfect for a wide range of electronic devices. Enjoy enhanced performance and efficiency with its low drain-source on resistance and high operating temperature. Trust Onsemi's reputation for excellence in semiconductor technology to deliver top-notch products like the NTF3055-160T3LF. Upgrade your devices today with this exceptional FET!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Power FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have faster switching speeds and lower on-resistance compared to P-channel FETs, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode feature allows for efficient freewheeling and protection against reverse currents in the circuit, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this Power FET offers high efficiency and fast switching speeds for optimal performance in various electronic circuits.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this Power FET can withstand elevated temperatures without compromising performance, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NTF3055-160T3LF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF3055-160T3LF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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