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NTF3055-100T1

Onsemi

NTF3055-100T1 by Onsemi

NTF3055-100T1 by Onsemi is a Power FET with 60V DS Breakdown Voltage, 9A IDM, and 0.11 ohm RDS(on). Ideal for SWITCHING applications, it features an N-CHANNEL configuration in a SMALL OUTLINE package with GULL WING terminals. Operating in ENHANCEMENT MODE, this FET has a max power dissipation of 1.3W at 175°C.

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9

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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ComSIT USA

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Digiode

USA . 1,845 parts In-Stock

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PC Components Company LLC

USA . 289 parts In-Stock

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Bristol Electronics

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Nova Conductors

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Prism Electronics

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AZTECH Wire

Italy . 873 parts In-Stock

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Ampacity Inc.

Singapore . 1,263 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,299 parts In-Stock

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TANS Electronics

Latvia . 6,726 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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SupplyDigital Components

Austria . 4,057 parts In-Stock

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Corphita

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Overview

Discover the power and efficiency of the NTF3055-100T1 by Onsemi, a top-tier manufacturer known for quality and reliability. As a Power Field Effect Transistor (FET), this N-CHANNEL single configuration with built-in diode is perfect for switching applications. With a maximum pulsed drain current of 9A and a low on-resistance of only 0.11 ohm, this transistor offers exceptional performance and durability. Ideal for various electronic devices, the NTF3055-100T1 delivers value, benefits, and advantages that cater to the needs of customers seeking high-quality components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the FET more durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance characteristics compared to P-Channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from damage due to reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control power flow in various electronic circuits.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making this FET suitable for modern electronic devices.

Maximum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltage levels without breakdown, ensuring reliability in operation.

Avalanche Energy Rating (EAS): 74 mJ

The high avalanche energy rating makes this FET suitable for applications where high energy pulses may be encountered.

Maximum Drain-Source On Resistance: 0.11 ohm

Low on-resistance results in less power loss and higher efficiency in switching applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTF3055-100T1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

74 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

9 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF3055-100T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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