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NTF3N08

Onsemi

NTF3N08 by Onsemi

NTF3N08 by Onsemi is a single N-channel power FET with 80V DS breakdown voltage. It features 0.14 ohm max RDS(on) and operates in enhancement mode for switching applications. This MOSFET, in a small outline package, is ideal for surface mount designs requiring high efficiency and low power dissipation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,100 parts In-Stock

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Vyrian

USA . 1,523 parts In-Stock

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1,523

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TANS Electronics

Latvia . 8,274 parts In-Stock

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Kulean Microsystems

USA . 7,703 parts In-Stock

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7,703

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Problanco Electronics

Mexico . 7,387 parts In-Stock

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SupplyDigital Components

Austria . 3,177 parts In-Stock

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UHIMA Technologies

Türkiye . 677 parts In-Stock

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677

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Corphita

USA . 423 parts In-Stock

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Corohmni

South Africa . 316 parts In-Stock

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Overview

Discover the power of the NTF3N08 by Onsemi, a high-quality Power FET that offers unmatched reliability and performance. Manufactured by Onsemi, a trusted industry leader, this N-channel transistor is ideal for switching applications. With a minimum DS breakdown voltage of 80V and a low on-resistance of 0.14 ohm, this transistor provides efficient power management. Its compact design and surface-mount capability make it versatile for a wide range of electronic projects. Trust Onsemi for superior quality and choose the NTF3N08 for your next application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in the specified direction, enhancing performance.

Minimum DS Breakdown Voltage: 80 V

Suitable for applications requiring high voltage handling capabilities.

Surface Mount: YES

Ease of installation and space-saving design.

Transistor Application: SWITCHING

Designed for switching applications, ensuring reliable performance.

Maximum Drain-Source On Resistance: 0.14 ohm

Low on-resistance leads to reduced power loss and improved efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable and well-established technology for FETs.

Technical Specifications

Power Field Effect Transistors (FET) NTF3N08 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

80 V

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF3N08 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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