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NTF3055L108T3G

Onsemi

NTF3055L108T3G by Onsemi

NTF3055L108T3G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 60V DS Breakdown Voltage, 9A Max Pulsed Drain Current, and 0.12 ohm Drain-Source On Resistance. This MOSFET operates in ENHANCEMENT MODE and has a max power dissipation of 2.1W, making it ideal for high-power switching circuits.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 69,410 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,463 parts In-Stock

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$1.530

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$1.530

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AZTECH Wire

Italy . 746 parts In-Stock

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$14.536

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Ampacity Inc.

Singapore . 1,382 parts In-Stock

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$51.050

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Semicontronic

India . 785 parts In-Stock

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$65.050

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$63.424

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$63.098

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785

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Component Stockers USA

USA . 370 parts In-Stock

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$99.990

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Kepictronics

USA . 10,105 parts In-Stock

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RC Electronics

USA . 7,200 parts In-Stock

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Problanco Electronics

Mexico . 6,286 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,723 parts In-Stock

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Kulean Microsystems

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TANS Electronics

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SupplyDigital Components

Austria . 3,978 parts In-Stock

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Continental Prestige Electronics

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Advanced Electronics

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Corphita

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Argo Parts USA

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UHIMA Technologies

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Corohmni

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Bastille Electronics

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Overview

Upgrade your power systems with the NTF3055L108T3G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power FETs that are perfect for switching applications. This N-channel transistor offers enhanced performance and efficiency, making it a valuable addition to any project. With a built-in diode, small outline package style, and high operating temperature, this transistor provides reliable power handling with minimal resistance. Trust Onsemi to provide cutting-edge technology that meets your power needs effectively and efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring longevity and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher switching speeds compared to their P-channel counterparts, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against voltage spikes and reverse currents, enhancing the robustness of the FET and increasing its overall efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast and efficient switching capabilities, making it ideal for power management and control circuits.

Surface Mount: YES

The surface-mount capability allows for easy and convenient integration onto PCBs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60 V, this FET can handle higher voltage levels, making it suitable for a wide range of power applications.

Maximum Drain Current (ID): 3 A

Capable of handling a maximum drain current of 3 A, this FET can effectively manage high levels of current flow, ensuring efficient operation in demanding circuits.

Maximum Power Dissipation (Abs): 2.1 W

With a maximum power dissipation of 2.1 W, this FET can effectively dissipate heat generated during operation, ensuring optimal performance and reliability.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C allows the FET to function reliably in elevated temperature environments, expanding its range of potential applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance and efficiency compared to other FET technologies, making this FET a reliable choice for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) NTF3055L108T3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

74 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

9 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF3055L108T3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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