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NTF3055L108T3LF

Onsemi

NTF3055L108T3LF by Onsemi

NTF3055L108T3LF by Onsemi is a Power FET with 60V DS Breakdown Voltage, 9A IDM, and 0.12 ohm RDS(on). Ideal for SWITCHING applications, this N-CHANNEL transistor operates in ENHANCEMENT MODE with a max power dissipation of 2.1W. It comes in a PLASTIC/EPOXY package style with GULL WING terminals.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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J2 Sourcing AB

Sweden . 11,888 parts In-Stock

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Vyrian

USA . 6,134 parts In-Stock

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Digiode

USA . 129 parts In-Stock

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Nova Conductors

Japan . 32 parts In-Stock

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Aztec Data Supply Inc.

USA . 110 parts In-Stock

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$1.150

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AZTECH Wire

Italy . 798 parts In-Stock

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$11.173

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Semicontronic

India . 498 parts In-Stock

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$57.050

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$55.624

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$55.338

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Ampacity Inc.

Singapore . 1,590 parts In-Stock

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$62.050

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SupplyDigital Components

Austria . 4,077 parts In-Stock

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Kulean Microsystems

USA . 3,559 parts In-Stock

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Continental Prestige Electronics

USA . 3,097 parts In-Stock

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TANS Electronics

Latvia . 2,128 parts In-Stock

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Problanco Electronics

Mexico . 875 parts In-Stock

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Corphita

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Argo Parts USA

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Corohmni

South Africa . 122 parts In-Stock

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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Bastille Electronics

Australia . 27 parts In-Stock

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Overview

Enhance the power and efficiency of your electronic devices with the NTF3055L108T3LF by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This Power Field Effect Transistor (FET) is perfect for switching applications, offering enhanced performance and a built-in diode for added convenience. With a high operating temperature and low on-resistance, this transistor provides exceptional value and benefits to customers looking to optimize their electronic designs. Upgrade your devices with the NTF3055L108T3LF and experience superior power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package durable and resistant to environmental factors, ensuring the longevity and reliability of the product.

Polarity or Channel Type: N-CHANNEL

N-Channel type is commonly used for most power applications and offers lower conduction losses, making it an efficient choice for power FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies the circuit design and protects the transistor from voltage spikes, increasing the overall efficiency and reliability of the system.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and low on-resistance, making it suitable for high-frequency operations.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and reducing overall system size.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, providing a reliable solution for power applications.

Maximum Pulsed Drain Current (IDM): 9 A

The high pulsed drain current rating allows for short bursts of high current, making it suitable for applications requiring high power handling capabilities.

Maximum Power Dissipation (Abs): 2.1 W

With a high power dissipation rating, this FET can handle heat dissipation effectively, ensuring reliable performance under high power conditions.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows for operation in harsh environments, making it suitable for a wide range of industrial applications.

Maximum Drain-Source On Resistance: 0.12 ohm

Low on-resistance minimizes power losses and improves efficiency, making it an excellent choice for applications where low power dissipation is critical.

Technical Specifications

Power Field Effect Transistors (FET) NTF3055L108T3LF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

74 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

9 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF3055L108T3LF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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