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NTD6600NT4G

Onsemi

NTD6600NT4G by Onsemi

NTD6600NT4G by Onsemi is an N-CHANNEL Power FET with 100V DS Breakdown Voltage and 44A IDM. Ideal for SWITCHING applications, it features a 0.146 ohm Drain-Source Resistance and 72mJ Avalanche Energy Rating. Suitable for ENHANCEMENT MODE operation in various electronic devices.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 6,084 parts In-Stock

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PC Components Company LLC

USA . 1,725 parts In-Stock

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Bristol Electronics

USA . 1,725 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 529 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Kulean Microsystems

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Problanco Electronics

Mexico . 6,897 parts In-Stock

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SupplyDigital Components

Austria . 6,558 parts In-Stock

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TANS Electronics

Latvia . 3,680 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,447 parts In-Stock

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Perfect Parts

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Futuretech Components

Singapore . 510 parts In-Stock

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Corohmni

South Africa . 418 parts In-Stock

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UHIMA Technologies

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Corphita

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Overview

Unlocking limitless power and performance, the NTD6600NT4G by Onsemi is a game-changer in the world of Power Field Effect Transistors. With a focus on quality and reliability, Onsemi delivers cutting-edge technology that exceeds industry standards. Ideal for switching applications, this N-CHANNEL transistor offers unparalleled efficiency and versatility. Experience seamless functionality and maximum output with the NTD6600NT4G, setting new benchmarks for power management solutions. Elevate your projects to new heights with the superior performance and value of Onsemi's groundbreaking transistor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides durability and protection to the transistor, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and allows for more efficient switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high performance and reliability in such scenarios.

Minimum DS Breakdown Voltage: 100 V

High breakdown voltage allows for use in high voltage applications, increasing the versatility of the transistor.

Surface Mount: YES

Surface mount capability facilitates easy and efficient installation on circuit boards, saving time and effort.

Maximum Pulsed Drain Current (IDM): 44 A

High pulsed drain current rating enables the transistor to handle heavy loads and surges effectively.

Avalanche Energy Rating (EAS): 72 mJ

High avalanche energy rating ensures the transistor can withstand sudden energy surges without damage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in power management applications.

Maximum Drain-Source On Resistance: 0.146 ohm

Low on-resistance improves efficiency and reduces power loss in the transistor during operation.

Technical Specifications

Power Field Effect Transistors (FET) NTD6600NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.146 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD6600NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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