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NTD6600NT4

Onsemi

NTD6600NT4 by Onsemi

NTD6600NT4 by Onsemi is an N-channel Power FET with a 100V DS breakdown voltage and 44A max pulsed drain current. Ideal for switching applications, it features a built-in diode, 0.146 ohm max RDS(on), and operates in enhancement mode. Suitable for surface mount assembly, this MOSFET has a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,140 parts In-Stock

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Digiode

USA . 1,176 parts In-Stock

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AZTECH Wire

Italy . 834 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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TANS Electronics

Latvia . 6,449 parts In-Stock

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Kulean Microsystems

USA . 6,046 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,868 parts In-Stock

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Corphita

USA . 1,809 parts In-Stock

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SupplyDigital Components

Austria . 1,748 parts In-Stock

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UHIMA Technologies

Türkiye . 939 parts In-Stock

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Problanco Electronics

Mexico . 585 parts In-Stock

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Corohmni

South Africa . 112 parts In-Stock

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Overview

Unleash the power of innovation with the NTD6600NT4 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor is designed to elevate your switching applications to new heights. Boasting a single configuration with a built-in diode, this N-CHANNEL transistor offers seamless performance and reliability. Whether you're looking to enhance your electronic devices or optimize your power systems, the NTD6600NT4 delivers unparalleled value and efficiency. Trust in Onsemi's legacy of excellence and embrace the endless possibilities that this high-quality product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the transistor, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type allows for efficient current flow and control in electronic circuits, making it suitable for various applications.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this transistor can withstand higher voltages without failing, making it suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer improved performance and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 44 A

High pulsed drain current rating allows for the handling of sudden surges in current, making it reliable in demanding situations.

Avalanche Energy Rating (EAS): 72 mJ

High avalanche energy rating means the transistor can handle high-energy spikes without damage, ensuring robust performance.

Maximum Drain Current (ID): 12 A

With a high drain current rating, this transistor can handle substantial current flow, suitable for power applications.

Maximum Drain-Source On Resistance: 0.146 ohm

Low drain-source on resistance minimizes power loss and improves efficiency in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD6600NT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.146 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD6600NT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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