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NTD6600N

Onsemi

NTD6600N by Onsemi

NTD6600N by Onsemi is a Power FET with 100V DS Breakdown Voltage, 44A IDM, and 0.146 ohm RDS(on). Ideal for switching applications in enhancement mode, it features a built-in diode and operates in avalanche energy rating of 72mJ. This N-channel transistor is surface mountable with Gull Wing terminals.

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1k+

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Vyrian

USA . 5,521 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 107 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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Problanco Electronics

Mexico . 4,842 parts In-Stock

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Kulean Microsystems

USA . 2,467 parts In-Stock

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SupplyDigital Components

Austria . 847 parts In-Stock

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UHIMA Technologies

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TANS Electronics

Latvia . 719 parts In-Stock

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Corphita

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Overview

Upgrade your power switching applications with the NTD6600N by Onsemi. This high-quality N-channel Power FET boasts a built-in diode for seamless performance. With a maximum pulsed drain current of 44A and a breakdown voltage of 100V, this transistor is designed to deliver reliable results. Ideal for a variety of switching tasks, this product is a game-changer in the field. Trust Onsemi's expertise and invest in the NTD6600N for optimal value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for protecting the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

Provides efficient performance for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and improves overall performance.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs.

Minimum DS Breakdown Voltage: 100 V

Withstands high voltage applications, ensuring reliability.

Maximum Pulsed Drain Current (IDM): 44 A

Capable of handling high pulse currents, making it versatile for various applications.

Avalanche Energy Rating (EAS): 72 mJ

Provides protection against avalanche breakdown, increasing reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Modern and efficient technology for improved performance.

Maximum Drain Current (ID): 12 A

High drain current capability for demanding applications.

Maximum Drain-Source On Resistance: 0.146 ohm

Low on-resistance for efficient power handling.

Technical Specifications

Power Field Effect Transistors (FET) NTD6600N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.146 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD6600N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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