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NTD2955-001

Onsemi

NTD2955-001 by Onsemi

NTD2955-001 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 36A IDM, 216mJ EAS, and 0.18 ohm RDS(ON). With a max power dissipation of 55W and operating temperature of 175°C, it offers reliable performance in various electronic circuits.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 255 parts In-Stock

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$8.050

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AZTECH Wire

Italy . 351 parts In-Stock

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$12.007

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Kepictronics

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Continental Prestige Electronics

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Kulean Microsystems

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Argo Parts USA

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TANS Electronics

Latvia . 3,259 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 1,177 parts In-Stock

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Problanco Electronics

Mexico . 1,031 parts In-Stock

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Australia . 450 parts In-Stock

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UHIMA Technologies

Türkiye . 308 parts In-Stock

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Corohmni

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Overview

Unleash the power of the NTD2955-001 by Onsemi, a top-quality P-CHANNEL Power Field Effect Transistor (FET) with a built-in diode. Ideal for SWITCHING applications, this transistor offers exceptional performance and reliability. With a maximum pulsed drain current of 36 A and a low on-resistance of 0.18 ohm, this transistor delivers superior efficiency and functionality. Trust in Onsemi's expertise and innovation to bring you the best in semiconductor technology. Elevate your projects with the NTD2955-001 and experience the difference in performance and quality it brings.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are commonly used in applications where it is advantageous to have a positive voltage as the control signal.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow in the system.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides efficient and fast switching capabilities.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures the FET can handle higher voltage levels without breakdown.

Maximum Pulsed Drain Current (IDM): 36 A

The high pulsed drain current rating allows for handling sudden spikes in current without damage.

Maximum Power Dissipation (Abs): 55 W

With a high power dissipation rating, this FET can handle high power loads efficiently.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides better performance, high switching speeds, and low on-state resistance.

Maximum Operating Temperature: 175 °C

The FET can operate at high temperatures without compromising performance or reliability.

Maximum Drain-Source On Resistance: 0.18 ohm

The low on-resistance of the FET results in reduced power loss and improved efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NTD2955-001 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

216 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD2955-001 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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