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NTD20P06LT4

Onsemi

NTD20P06LT4 by Onsemi

NTD20P06LT4 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 50A and EAS of 304mJ, operating in ENHANCEMENT MODE. With a 0.15 ohm RDS(on), this transistor has a max power dissipation of 54W and can handle up to 15.5A drain current.

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4

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1k+

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Chip Stock

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Digiode

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 384 parts In-Stock

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$5.637

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Ampacity Inc.

Singapore . 620 parts In-Stock

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$46.050

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Semicontronic

India . 764 parts In-Stock

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$62.449

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$62.128

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Kulean Microsystems

USA . 7,386 parts In-Stock

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SupplyDigital Components

Austria . 7,236 parts In-Stock

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Continental Prestige Electronics

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Lixinc

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Problanco Electronics

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TANS Electronics

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Overview

Harness the power of cutting-edge technology with the NTD20P06LT4 by Onsemi. Designed for high-performance applications, this P-channel Power Field Effect Transistor offers unmatched reliability and efficiency. With a maximum operating temperature of 150°C and a minimum DS breakdown voltage of 60V, this transistor is ideal for switching applications. The single configuration with built-in diode ensures seamless integration, while the small outline package style makes it easy to install. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the NTD20P06LT4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

Allows for efficient use in applications where P-channel FETs are required.

Transistor Application: SWITCHING

Ideal for switching applications due to its design and characteristics.

Minimum DS Breakdown Voltage: 60 V

Suitable for high voltage applications, providing a safety margin.

Maximum Pulsed Drain Current (IDM): 50 A

Capable of handling high currents for brief periods, making it versatile.

Avalanche Energy Rating (EAS): 304 mJ

Can withstand and dissipate energy spikes effectively, increasing reliability.

Maximum Drain-Source On Resistance: 0.15 ohm

Low on-resistance ensures minimal power loss and efficient operation.

Maximum Drain Current (ID): 15.5 A

Designed to handle high continuous currents, suitable for various applications.

Maximum Power Dissipation (Abs): 54 W

With a high power dissipation rating, it can handle moderate to high power levels.

Maximum Operating Temperature: 150 °C

Able to operate in high-temperature environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NTD20P06LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

304 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15.5 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD20P06LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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