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NTD2955

Onsemi

NTD2955 by Onsemi

NTD2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 36A and EAS of 216mJ, operating in ENHANCEMENT MODE. With a package style of SMALL OUTLINE and 0.18 ohm RDS(on), it offers high performance in various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 1,765 parts In-Stock

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Digiode

USA . 1,452 parts In-Stock

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Vyrian

USA . 315 parts In-Stock

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315

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Prism Electronics

USA . 35 parts In-Stock

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35

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Nova Conductors

Japan . 23 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,510 parts In-Stock

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$1.690

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2,510

$1.690

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AZTECH Wire

Italy . 522 parts In-Stock

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$15.605

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522

$15.605

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Ampacity Inc.

Singapore . 602 parts In-Stock

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$55.050

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602

$55.050

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Semicontronic

India . 1,142 parts In-Stock

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$62.050

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$60.499

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$60.188

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1,142

$62.050

$60.499

$60.188

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RC Electronics

USA . 27,000 parts In-Stock

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Lixinc

USA . 18,896 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,387 parts In-Stock

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Problanco Electronics

Mexico . 6,027 parts In-Stock

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SupplyDigital Components

Austria . 5,535 parts In-Stock

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Argo Parts USA

USA . 4,911 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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TANS Electronics

Latvia . 3,219 parts In-Stock

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Corphita

USA . 2,255 parts In-Stock

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Kulean Microsystems

USA . 681 parts In-Stock

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Corohmni

South Africa . 136 parts In-Stock

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UHIMA Technologies

Türkiye . 73 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 15 parts In-Stock

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Overview

Power up your applications with the NTD2955 by Onsemi. This high-quality P-Channel Power Field Effect Transistor is designed for switching applications, offering a maximum pulsed drain current of 36A and a minimum breakdown voltage of 60V. Its single configuration with built-in diode ensures efficient performance, while its small outline package makes it easy to use in various projects. Trust Onsemi's expertise in semiconductor technology to deliver reliable and durable components. Upgrade your systems with the NTD2955 and experience the value and benefits of top-notch performance.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type:

P-CHANNEL - P-channel FETs are known for their high efficiency and low power consumption, making this product a great choice for energy-efficient designs.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and saves space, making this FET ideal for compact applications.

Transistor Application:

SWITCHING - Designed specifically for switching applications, this FET offers fast switching speeds and high performance.

Surface Mount:

YES - With surface mount capability, this FET is easy to integrate into printed circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage:

60 V - This voltage rating ensures reliable operation and protection against voltage spikes, making this FET suitable for high voltage circuits.

Package Shape:

RECTANGULAR - The rectangular shape of the package provides versatility in mounting options, allowing for flexibility in design layouts.

Terminal Form:

GULL WING - The gull wing terminals offer secure connections and easy soldering, enhancing reliability in circuit connections.

Operating Mode:

ENHANCEMENT MODE - This mode allows for easy control of the FET, making it a versatile choice for various applications.

Maximum Pulsed Drain Current (IDM):

36 A - With a high pulsed drain current, this FET can handle sudden spikes in current, making it suitable for high power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD2955 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

216 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD2955 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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