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NTD24N06LT4G

Onsemi

NTD24N06LT4G by Onsemi

NTD24N06LT4G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 24A ID, and 0.045 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. Operating in ENHANCEMENT MODE, it has a max IDM of 72A and EAS of 162mJ.

Median Price

$0.628

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

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Newark

USA . 5,000 parts In-Stock

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$0.743

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$0.713

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$0.743

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$0.713

Mouser Electronics

USA . 4,018 parts In-Stock

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$2.500

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$1.030

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$0.858

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$2.500

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Future Electronics

Canada . 45,000 parts In-Stock

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$0.365

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$0.365

Arrow

USA . 35,000 parts In-Stock

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Verical

USA . 35,000 parts In-Stock

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$0.583

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Chip1Stop

Japan . 15,000 parts In-Stock

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$0.606

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$0.606

DigiKey

USA . 2,636 parts In-Stock

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$0.650

2,636

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Avnet

USA . 2,500 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,726 parts In-Stock

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$0.850

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$0.850

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TME

Poland . 2,194 parts In-Stock

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$0.990

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$0.634

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$0.565

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$0.542

2,194

$0.990

$0.634

$0.565

$0.542

Nova Conductors

Japan . 500 parts In-Stock

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Bristol Electronics

USA . 43 parts In-Stock

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$1.875

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$0.750

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IBS Electronics

USA . 160,000 parts In-Stock

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NAC Semi

USA . 60,000 parts In-Stock

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$0.760

Chip Stock

USA . 18,500 parts In-Stock

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Vyrian

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Sensible Micro Corp

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ComSIT Distribution GmbH

Germany . 314 parts In-Stock

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ComSIT USA

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Ashlea Components Ltd

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NexGen Digital

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Corohmni

South Africa . 173 parts In-Stock

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$0.421

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Ampacity Inc.

Singapore . 30,334 parts In-Stock

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$0.481

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$0.481

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Semicontronic

India . 30,302 parts In-Stock

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$0.481

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$0.469

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$0.467

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$0.481

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Corphita

USA . 872 parts In-Stock

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$0.806

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Argo Parts USA

USA . 4,591 parts In-Stock

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Continental Prestige Electronics

USA . 2,843 parts In-Stock

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$0.980

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Netroflash

USA . 50 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,451 parts In-Stock

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$1.430

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Benley Electronics

USA . 1 parts In-Stock

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Microchip USA

USA . 2,913 parts In-Stock

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Perfect Parts

USA . 292,643 parts In-Stock

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RC Electronics

USA . 69,456 parts In-Stock

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Kepictronics

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Lixinc

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Kulean Microsystems

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SupplyDigital Components

Austria . 4,115 parts In-Stock

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Problanco Electronics

Mexico . 4,032 parts In-Stock

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iodParts Technologies Inc.

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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TANS Electronics

Latvia . 948 parts In-Stock

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UHIMA Technologies

Türkiye . 658 parts In-Stock

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Overview

Discover the power of the NTD24N06LT4G by Onsemi, a top-quality Power FET that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this N-CHANNEL transistor is ideal for switching applications. With a built-in diode and high breakdown voltage, this transistor delivers outstanding efficiency and durability. Whether you're designing automotive systems, industrial equipment, or consumer electronics, the NTD24N06LT4G provides the value and benefits you need to take your projects to the next level. Experience the difference with Onsemi's superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel type offers efficient switching performance and lower conduction losses, making the transistor ideal for power applications.

Maximum Pulsed Drain Current (IDM): 72 A

High pulsed drain current rating allows the transistor to handle surges and peak power demands effectively.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliable performance in demanding environments without risk of overheating.

Maximum Drain-Source On Resistance: 0.045 ohm

Low on-resistance leads to reduced power dissipation and heat generation, increasing efficiency and reliability of the transistor.

Technical Specifications

Power Field Effect Transistors (FET) NTD24N06LT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

162 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD24N06LT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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