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NTD20N03L27T4G

Onsemi

NTD20N03L27T4G by Onsemi

NTD20N03L27T4G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 60A IDM. Ideal for SWITCHING applications, it features a 0.031 ohm Drain-Source On Resistance and operates in ENHANCEMENT MODE at up to 150°C.

Median Price

$0.955

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,698 parts In-Stock

1+ parts

$1.290

100+ parts

$0.579

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$0.419

10k+ parts

$0.347

1,698

$1.290

$0.579

$0.419

$0.347

Mouser Electronics

USA . 16,419 parts In-Stock

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$1.740

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$0.736

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DigiKey

USA . 8,393 parts In-Stock

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$1.740

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$0.735

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$0.528

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8,393

$1.740

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Newark

USA . 4,951 parts In-Stock

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$1.770

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$0.838

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$0.644

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4,951

$1.770

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Element14

Singapore . 1,698 parts In-Stock

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$2.210

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$0.986

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$0.621

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1,698

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$0.986

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$0.592

Chip1Stop

Japan . 15,000 parts In-Stock

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$0.533

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Arrow

USA . 12,500 parts In-Stock

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$0.448

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Verical

USA . 12,500 parts In-Stock

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$0.450

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RS (Exports)

UK . 4,940 parts In-Stock

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Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

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Rochester

USA . 2,198 parts In-Stock

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$0.535

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$0.444

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$0.396

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Distributors (In-Stock)

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Digiode

USA . 1,001 parts In-Stock

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$0.515

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Nova Conductors

Japan . 100 parts In-Stock

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Chip Stock

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Component Sense

UK . 19,106 parts In-Stock

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Cyclops Electronics Ltd

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Vyrian

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NAC Semi

USA . 7,500 parts In-Stock

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A2Z Electronics, Inc.

USA . 6,251 parts In-Stock

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Bristol Electronics

USA . 5,487 parts In-Stock

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USA . 2,500 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1,178 parts In-Stock

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PC Components Company LLC

USA . 1,044 parts In-Stock

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Semi Source

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LIBRA Elektronik GmbH

Germany . 658 parts In-Stock

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ComSIT Distribution GmbH

Germany . 351 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 239 parts In-Stock

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Dan-Mar Components

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EMSNET

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Speed Components Ltd

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,494 parts In-Stock

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$0.453

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$0.453

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Semicontronic

India . 7,209 parts In-Stock

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$0.453

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$0.442

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$0.439

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Corohmni

South Africa . 261 parts In-Stock

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Corphita

USA . 2,019 parts In-Stock

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$0.488

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Argo Parts USA

USA . 1,602 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.769

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$0.731

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$0.715

100

$0.769

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$0.715

Continental Prestige Electronics

USA . 28 parts In-Stock

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$1.060

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$0.768

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$0.635

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28

$1.060

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Aztec Data Supply Inc.

USA . 2,363 parts In-Stock

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$1.290

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2,363

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Component Stockers USA

USA . 32,702 parts In-Stock

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$1.480

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$0.950

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$0.650

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$0.550

32,702

$1.480

$0.950

$0.650

$0.550

Microchip USA

USA . 7,129 parts In-Stock

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$4.437

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Perfect Parts

USA . 124,323 parts In-Stock

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Lixinc

USA . 16,369 parts In-Stock

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ChipstoGo Electronic ltd

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Robosynatics

Brazil . 9,190 parts In-Stock

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Lucentia Tech

USA . 9,190 parts In-Stock

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$0.983

SupplyDigital Components

Austria . 6,738 parts In-Stock

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ChipTracer

USA . 4,463 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

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Problanco Electronics

Mexico . 1,814 parts In-Stock

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Assy Fe

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Computer Components Inc. - USA

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UHIMA Technologies

Türkiye . 397 parts In-Stock

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Kepictronics

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GreenTree Electronics

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Overview

Unleash the power of innovation with the NTD20N03L27T4G by Onsemi. Designed with precision and reliability, this Power Field Effect Transistor (FET) offers unparalleled performance in switching applications. With a single configuration and built-in diode, this N-channel transistor provides seamless operation and enhanced efficiency. Whether you're looking to optimize your circuit design or enhance power management, this Onsemi product delivers unmatched value and benefits. Trust in Onsemi for cutting-edge technology and superior quality that meets your needs. Elevate your projects with the NTD20N03L27T4G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good insulation, mechanical strength, and durability, making the product reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for freewheeling current to protect the circuit from back EMF, enhancing the reliability and performance of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast switching speeds, making it suitable for use in power management applications.

Surface Mount: YES

Being surface mountable, this FET is easy to assemble on PCBs, saving space and allowing for automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages, making it suitable for use in medium-power applications.

Maximum Pulsed Drain Current (IDM): 60 A

The high pulsed drain current rating of 60A allows for handling short-duration high current pulses, making this FET reliable in demanding applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can operate in high-temperature environments, ensuring stable performance under varying conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTD20N03L27T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

288 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD20N03L27T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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