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NTD25P03L1G

Onsemi

NTD25P03L1G by Onsemi

NTD25P03L1G by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, 75A IDM, and 0.08 ohm RDS(on). Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE at up to 150 °C, it offers high power dissipation of 75W.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 136,046 parts In-Stock

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Vyrian

USA . 7,843 parts In-Stock

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Digiode

USA . 2,097 parts In-Stock

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Benley Electronics

USA . 58 parts In-Stock

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$0.250

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58

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AZTECH Wire

Italy . 453 parts In-Stock

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$8.880

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453

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A-Z Elektronik GmbH

Germany . 7,110 parts In-Stock

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Problanco Electronics

Mexico . 6,779 parts In-Stock

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TANS Electronics

Latvia . 5,699 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 2,331 parts In-Stock

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SupplyDigital Components

Austria . 1,961 parts In-Stock

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Corphita

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Corohmni

South Africa . 460 parts In-Stock

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UHIMA Technologies

Türkiye . 414 parts In-Stock

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Perfect Parts

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Overview

Upgrade your power systems with the NTD25P03L1G by Onsemi, a high-quality power FET designed for switching applications. Boasting a built-in diode and a rugged construction made of plastic/epoxy, this P-channel transistor offers reliable performance and efficient power management. With a maximum drain current of 25A and a low on-resistance of 0.08 ohms, this transistor delivers superior power handling capabilities. Perfect for a wide range of industrial and automotive applications, the NTD25P03L1G provides value, efficiency, and durability for all your power needs. Elevate your systems with Onsemi's trusted technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the FET, making it suitable for various operating conditions.

Polarity or Channel Type: P-CHANNEL

The P-channel type allows for easy integration into circuits and provides efficient switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and ensures reliable operation, making it a convenient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and efficiency in controlling current flow.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can withstand high voltage levels, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into circuit boards, simplifying the installation process.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ease of soldering, ensuring reliable performance in different environments.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for efficient control of the transistor, making it suitable for various switching applications.

Maximum Pulsed Drain Current (IDM): 75 A

With a high maximum pulsed drain current of 75A, this FET can handle high current loads, making it ideal for demanding applications.

Avalanche Energy Rating (EAS): 200 mJ

The high avalanche energy rating of 200mJ ensures robust performance and reliability under transient conditions, making this FET a dependable choice.

Maximum Drain Current (Abs) (ID): 25 A

With a maximum drain current of 25A, this FET can handle moderate to high current levels, making it suitable for a wide range of applications.

No. of Terminals: 3

With three terminals, this FET offers flexibility in circuit connections and allows for various configuration options, making it versatile for different applications.

Maximum Power Dissipation (Abs): 75 W

The high maximum power dissipation of 75W ensures efficient heat dissipation and reliable performance even under high power conditions.

Package Style (Meter): IN-LINE

The in-line package style provides a compact form factor and easy integration into circuit layouts, making it suitable for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology ensures high performance and reliability, making this FET a dependable choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperature environments, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

The silicon transistor element material provides high conductivity and reliability, ensuring stable performance in various operating conditions.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and reliable connection, ensuring long-term performance and durability.

Maximum Drain-Source On Resistance: 0.08 ohm

With a low maximum drain-source on resistance of 0.08 ohm, this FET offers efficient current flow and minimal power loss, making it energy-efficient.

Terminal Position: SINGLE

With a single terminal position, this FET offers simplicity in circuit connections and ensures ease of installation, making it user-friendly.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation and ensures reliable performance, making this FET suitable for high-power applications.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260 °C, this FET can withstand high-temperature soldering processes, ensuring reliable solder connections.

Technical Specifications

Power Field Effect Transistors (FET) NTD25P03L1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

75 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD25P03L1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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