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NTD24N06L

Onsemi

NTD24N06L by Onsemi

NTD24N06L by Onsemi is a power FET with N-channel configuration and built-in diode, ideal for switching applications. It features a max drain current of 24A, min DS breakdown voltage of 60V, and peak reflow temperature of 235 °C. This MOSFET operates in enhancement mode with a low on-resistance of 0.045 ohm, making it suitable for high-power applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,440 parts In-Stock

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Digiode

USA . 705 parts In-Stock

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AZTECH Wire

Italy . 1,038 parts In-Stock

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$14.720

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Component Stockers USA

USA . 494 parts In-Stock

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$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,657 parts In-Stock

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Problanco Electronics

Mexico . 6,099 parts In-Stock

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SupplyDigital Components

Austria . 4,537 parts In-Stock

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Kulean Microsystems

USA . 3,526 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 865 parts In-Stock

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Corohmni

South Africa . 265 parts In-Stock

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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Overview

Unlock the power of efficiency and reliability with the NTD24N06L by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that excel in switching applications. The NTD24N06L offers customers a single configuration with a built-in diode, maximizing performance and simplifying installations. With a minimum DS Breakdown Voltage of 60V and a Maximum Pulsed Drain Current of 72A, this transistor ensures optimal functionality in various electronic systems. Trust Onsemi to provide superior products that elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching capabilities and can handle high current flow, ideal for power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance for tasks that require frequent on/off cycles.

Minimum DS Breakdown Voltage: 60 V

Can withstand high voltage levels, making it suitable for use in power supply circuits and other high voltage applications.

Maximum Drain Current (Abs) (ID): 24 A

Capable of handling high current flow, making it suitable for powering various electronic devices and circuits.

Maximum Power Dissipation (Abs): 1.36 W

Efficiently dissipates heat generated during operation, ensuring stable performance under varying load conditions.

Maximum Operating Temperature: 175 °C

Can operate effectively in high temperature environments, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD24N06L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

162 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD24N06L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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