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NTB22N06T4

Onsemi

NTB22N06T4 by Onsemi

NTB22N06T4 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 66A IDM, and 0.06 ohm RDS. Ideal for SWITCHING applications, it features a built-in DIODE and operates in ENHANCEMENT MODE. This PLASTIC/EPOXY transistor has a max power dissipation of 60W and can withstand temperatures up to 175 °C.

Median Price

$0.267

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,800 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

4,800

-

$0.277

$0.230

$0.205

Verical

USA . 2,400 parts In-Stock

1+ parts

-

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$0.257

2,400

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-

-

$0.257

Distributors (In-Stock)

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Digiode

USA . 290 parts In-Stock

1+ parts

$0.217

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290

$0.217

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Vyrian

USA . 2,317 parts In-Stock

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2,317

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Distributors (Availability)

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Corphita

USA . 1,388 parts In-Stock

1+ parts

$0.205

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1,388

$0.205

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Corohmni

South Africa . 399 parts In-Stock

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$0.228

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399

$0.228

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Component Stockers USA

USA . 3,506 parts In-Stock

1+ parts

$0.230

100+ parts

$0.220

1k+ parts

$0.200

10k+ parts

-

3,506

$0.230

$0.220

$0.200

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AZTECH Wire

Italy . 75 parts In-Stock

1+ parts

$17.280

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75

$17.280

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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TANS Electronics

Latvia . 5,707 parts In-Stock

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Continental Prestige Electronics

USA . 4,800 parts In-Stock

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$0.209

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4,800

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$0.209

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Problanco Electronics

Mexico . 4,484 parts In-Stock

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4,484

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SupplyDigital Components

Austria . 4,455 parts In-Stock

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4,455

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QUARKTWIN TECHNOLOGY LTD

USA . 3,310 parts In-Stock

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3,310

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Kulean Microsystems

USA . 2,539 parts In-Stock

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2,539

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UHIMA Technologies

Türkiye . 274 parts In-Stock

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274

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Overview

Discover the cutting-edge NTB22N06T4 by Onsemi, a superior Power FET that boasts exceptional quality and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL transistor is perfect for various switching applications. With a high DS breakdown voltage of 60V and maximum drain current of 22A, this transistor offers unmatched performance. Its compact design and built-in diode make it ideal for space-constrained projects. Trust in Onsemi's expertise and elevate your electronic designs with the NTB22N06T4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection, making this product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower conduction losses and higher efficiency, making this product a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current, offering convenience and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides efficient and reliable performance in various electronic circuits.

Maximum Pulsed Drain Current (IDM): 66 A

With a high maximum pulsed drain current, this FET can handle surge currents effectively, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 72 mJ

The high avalanche energy rating ensures robustness and reliability in high-stress conditions, making this product a preferable choice for critical applications.

Maximum Drain-Source On Resistance: 0.06 ohm

Having a low on-resistance helps in reducing power losses and improving efficiency, making this FET suitable for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB22N06T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

66 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB22N06T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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