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NTB22N06LT4

Onsemi

NTB22N06LT4 by Onsemi

NTB22N06LT4 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 66A IDM, and 0.065 ohm RDS. Ideal for SWITCHING applications due to its 175 °C Max Temp and 72mJ EAS rating. Features GULL WING terminals in a SMALL OUTLINE package style.

Median Price

$0.165

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,600 parts In-Stock

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-

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$0.165

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$0.137

10k+ parts

$0.122

1,600

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$0.165

$0.137

$0.122

Distributors (In-Stock)

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Digiode

USA . 1,290 parts In-Stock

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$0.128

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$0.128

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Vyrian

USA . 5,243 parts In-Stock

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Corphita

USA . 799 parts In-Stock

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$0.122

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799

$0.122

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Corohmni

South Africa . 191 parts In-Stock

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$0.135

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191

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AZTECH Wire

Italy . 590 parts In-Stock

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$17.350

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590

$17.350

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,761 parts In-Stock

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Kulean Microsystems

USA . 7,952 parts In-Stock

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SupplyDigital Components

Austria . 5,873 parts In-Stock

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Problanco Electronics

Mexico . 4,527 parts In-Stock

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TANS Electronics

Latvia . 3,865 parts In-Stock

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UHIMA Technologies

Türkiye . 348 parts In-Stock

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348

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Overview

Unleash the power of the NTB22N06LT4 by Onsemi, a cutting-edge Power Field Effect Transistor that guarantees superior performance and reliability. Manufactured by Onsemi, a leader in semiconductor technology, this N-CHANNEL transistor is ideal for switching applications. With a maximum drain current of 22 A and a low on-resistance of 0.065 ohm, this transistor offers unmatched efficiency and durability. Whether you're designing automotive systems, industrial equipment, or consumer electronics, the NTB22N06LT4 provides the quality and value you need to take your projects to the next level. Choose Onsemi for innovation that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Power FET, ensuring longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL Power FETs are commonly used for higher efficiency and lower ON resistance, making them suitable for a variety of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and helps in preventing damage from voltage spikes and reverse currents.

Transistor Application: SWITCHING

Designed for switching applications, this Power FET allows for efficient and rapid control of power flow in electronic circuits.

Surface Mount: YES

Surface mount technology makes installation and assembly easier, saving time and reducing overall production costs.

Maximum Power Dissipation (Abs): 60 W

With a high maximum power dissipation rating, this Power FET can handle significant power loads without overheating or damage.

Maximum Drain-Source On Resistance: 0.065 ohm

The low ON resistance of this Power FET results in minimal power loss and efficient operation in circuit applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB22N06LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

66 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB22N06LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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