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NTB25P06

Onsemi

NTB25P06 by Onsemi

The Onsemi NTB25P06 is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 80A IDM, 600mJ EAS, and 0.082 ohm RDS(on). The PLASTIC/EPOXY package with GULL WING terminals operates at up to 150 °C, making it suitable for high-power circuits.

Median Price

$0.364

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 150 parts In-Stock

1+ parts

$0.364

100+ parts

$0.342

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$0.309

10k+ parts

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150

$0.364

$0.342

$0.309

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Distributors (In-Stock)

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Digiode

USA . 667 parts In-Stock

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$0.346

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$0.346

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American Microsemiconductor Inc.

USA . 50 parts In-Stock

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$2.630

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50

$2.630

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Vyrian

USA . 2,475 parts In-Stock

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A&K Electronics

USA . 81 parts In-Stock

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Bristol Electronics

USA . 81 parts In-Stock

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81

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J2 Sourcing AB

Sweden . 50 parts In-Stock

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50

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Distributors (Availability)

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Corphita

USA . 374 parts In-Stock

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$0.328

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374

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Corohmni

South Africa . 466 parts In-Stock

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$0.364

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466

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AZTECH Wire

Italy . 1,177 parts In-Stock

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$12.330

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Kepictronics

USA . 20,000 parts In-Stock

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TANS Electronics

Latvia . 7,200 parts In-Stock

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Problanco Electronics

Mexico . 5,729 parts In-Stock

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Kulean Microsystems

USA . 4,063 parts In-Stock

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SupplyDigital Components

Austria . 3,455 parts In-Stock

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UHIMA Technologies

Türkiye . 164 parts In-Stock

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Overview

Discover the power of the NTB25P06 from Onsemi, a top-quality N-CHANNEL Power FET with a built-in diode for enhanced performance in switching applications. With a high DS breakdown voltage of 60V and a maximum drain current of 27.5A, this transistor offers reliability and efficiency like no other. Perfect for various industrial and automotive applications, the NTB25P06 delivers superior power dissipation capabilities and temperature resistance up to 150 °C. Trust Onsemi's expertise and choose the NTB25P06 for unparalleled value and performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability of the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protection for reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

The ability to be surface mounted allows for compact and space-saving PCB designs.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage provides protection against voltage spikes and surges.

Maximum Pulsed Drain Current (IDM): 80 A

Capable of handling high pulsed currents without damage, suitable for demanding applications.

Avalanche Energy Rating (EAS): 600 mJ

High avalanche energy rating indicates robustness and ability to withstand energy spikes.

Maximum Power Dissipation (Abs): 100 W

High power dissipation capability ensures reliable operation under high load conditions.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance or reliability.

Technical Specifications

Power Field Effect Transistors (FET) NTB25P06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

600 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

27.5 A

Maximum Drain-Source On Resistance:

.082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB25P06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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