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NTB23N03RG

Onsemi

NTB23N03RG by Onsemi

NTB23N03RG by Onsemi is a N-CHANNEL Power FET with 25V DS Breakdown Voltage and 60A IDM. Ideal for SWITCHING applications, it features a built-in diode, 0.06 ohm RDS(on), and operates in ENHANCEMENT MODE. This surface-mount transistor has a max power dissipation of 37.5W and can handle up to 23A continuous drain current.

Median Price

$0.170

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,350 parts In-Stock

1+ parts

-

100+ parts

$0.170

1k+ parts

$0.141

10k+ parts

$0.125

12,350

-

$0.170

$0.141

$0.125

DigiKey

USA . 12,350 parts In-Stock

1+ parts

-

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$0.140

12,350

-

-

-

$0.140

Verical

USA . 9,750 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.176

9,750

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-

-

$0.176

Distributors (In-Stock)

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Digiode

USA . 834 parts In-Stock

1+ parts

$0.132

100+ parts

-

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834

$0.132

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Vyrian

USA . 1,622 parts In-Stock

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$0.139

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1,622

$0.139

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Distributors (Availability)

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Corphita

USA . 659 parts In-Stock

1+ parts

$0.125

100+ parts

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659

$0.125

-

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Corohmni

South Africa . 387 parts In-Stock

1+ parts

$0.139

100+ parts

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387

$0.139

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Kepictronics

USA . 20,000 parts In-Stock

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20,000

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Continental Prestige Electronics

USA . 12,350 parts In-Stock

1+ parts

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100+ parts

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$0.129

10k+ parts

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12,350

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-

$0.129

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Kulean Microsystems

USA . 7,009 parts In-Stock

1+ parts

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7,009

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TANS Electronics

Latvia . 4,356 parts In-Stock

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4,356

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Problanco Electronics

Mexico . 4,126 parts In-Stock

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4,126

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SupplyDigital Components

Austria . 3,017 parts In-Stock

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UHIMA Technologies

Türkiye . 947 parts In-Stock

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947

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Overview

Upgrade your power systems with the NTB23N03RG by Onsemi. This high-quality N-channel Power FET offers unparalleled performance in switching applications, featuring a single configuration with a built-in diode for optimal efficiency. With a maximum drain current of 23A and a minimum DS breakdown voltage of 25V, this transistor provides reliable power distribution while maintaining a low on-resistance of just 0.06 ohm. Trust Onsemi's expertise in semiconductor technology to deliver top-notch products that exceed your expectations. Whether you're working on automotive, industrial, or consumer electronics projects, the NTB23N03RG is the perfect solution for your power management needs. Experience the value and benefits of this innovative product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the FET, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and faster switching speeds compared to P-channel FETs, making them suitable for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching and provides protection against reverse current flow, making this FET ideal for applications where efficiency and reliability are important.

Transistor Application: SWITCHING

Designed for switching applications, this FET is optimized for fast turn-on and turn-off characteristics, making it suitable for power management and control circuits.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into electronic circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this FET can handle relatively high voltages, making it suitable for applications where voltage spikes or fluctuations may occur.

Technical Specifications

Power Field Effect Transistors (FET) NTB23N03RG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB23N03RG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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