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NTB27N06LT4

Onsemi

NTB27N06LT4 by Onsemi

NTB27N06LT4 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 80A IDM, and 0.048 ohm RDS(on). Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE at up to 175 °C, making it suitable for high-power tasks.

Median Price

$0.475

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,028 parts In-Stock

1+ parts

-

100+ parts

$0.475

1k+ parts

$0.395

10k+ parts

$0.352

20,028

-

$0.475

$0.395

$0.352

DigiKey

USA . 20,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.410

10k+ parts

-

20,028

-

-

$0.410

-

Verical

USA . 16,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.493

10k+ parts

$0.440

16,828

-

-

$0.493

$0.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,388 parts In-Stock

1+ parts

$0.370

100+ parts

-

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1,388

$0.370

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Vyrian

USA . 2,272 parts In-Stock

1+ parts

$0.390

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2,272

$0.390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,163 parts In-Stock

1+ parts

$0.351

100+ parts

-

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2,163

$0.351

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-

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Corohmni

South Africa . 215 parts In-Stock

1+ parts

$0.390

100+ parts

-

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215

$0.390

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Continental Prestige Electronics

USA . 20,028 parts In-Stock

1+ parts

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100+ parts

$0.358

1k+ parts

-

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20,028

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$0.358

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Problanco Electronics

Mexico . 6,925 parts In-Stock

1+ parts

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6,925

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Kulean Microsystems

USA . 4,495 parts In-Stock

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4,495

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SupplyDigital Components

Austria . 3,895 parts In-Stock

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3,895

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UHIMA Technologies

Türkiye . 379 parts In-Stock

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379

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TANS Electronics

Latvia . 33 parts In-Stock

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33

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Overview

Upgrade your power electronics with the NTB27N06LT4 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that excel in switching applications. With a minimum DS Breakdown Voltage of 60V and a maximum Drain Current of 27A, this N-CHANNEL transistor offers reliable performance and durability. Its built-in diode enhances efficiency, while the small outline package shape makes it easy to integrate into your project. Experience enhanced power management and improved circuitry with the NTB27N06LT4 - the perfect solution for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good insulation and protection for the transistor, ensuring reliability and longevity in various operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easier control of the transistor's switching behavior, making it suitable for a wide range of switching applications.

Maximum Power Dissipation (Abs): 88.2 W

High maximum power dissipation rating ensures that the transistor can handle high power levels without overheating, making it reliable for demanding applications.

Maximum Drain-Source On Resistance: 0.048 ohm

Low on-resistance of the drain-source channel minimizes power loss and improves efficiency in switching applications, making this transistor an energy-efficient choice.

Technical Specifications

Power Field Effect Transistors (FET) NTB27N06LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

94 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.048 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB27N06LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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