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NTB22N06

Onsemi

NTB22N06 by Onsemi

NTB22N06 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 66A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.06 ohm RDS(on), and 175 °C Max Operating Temp. Perfect for high-power circuits requiring efficient switching capabilities in compact designs.

Median Price

$0.165

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,729 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

2,729

-

$0.132

$0.110

$0.098

DigiKey

USA . 2,729 parts In-Stock

1+ parts

-

100+ parts

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$0.170

2,729

-

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-

$0.170

Verical

USA . 2,700 parts In-Stock

1+ parts

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$0.165

2,700

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-

$0.165

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 588 parts In-Stock

1+ parts

$0.103

100+ parts

-

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588

$0.103

-

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Vyrian

USA . 854 parts In-Stock

1+ parts

$0.108

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854

$0.108

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DigiKey Marketplace

USA . 2,729 parts In-Stock

1+ parts

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100+ parts

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$0.110

10k+ parts

-

2,729

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-

$0.110

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,425 parts In-Stock

1+ parts

$0.097

100+ parts

-

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1,425

$0.097

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-

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Corohmni

South Africa . 266 parts In-Stock

1+ parts

$0.108

100+ parts

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266

$0.108

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QUARKTWIN TECHNOLOGY LTD

USA . 20,840 parts In-Stock

1+ parts

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20,840

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SupplyDigital Components

Austria . 6,470 parts In-Stock

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6,470

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Problanco Electronics

Mexico . 5,994 parts In-Stock

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5,994

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Kulean Microsystems

USA . 4,222 parts In-Stock

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4,222

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UHIMA Technologies

Türkiye . 387 parts In-Stock

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387

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TANS Electronics

Latvia . 269 parts In-Stock

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269

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Overview

Discover the power and efficiency of the Onsemi NTB22N06 Power FET. Manufactured by a trusted industry leader, this N-channel transistor offers reliable performance in switching applications. With a high DS breakdown voltage of 60V and a maximum drain current of 22A, this transistor provides exceptional value and benefits to customers seeking a robust solution for their electronic projects. Whether you're designing power supplies, motor control systems, or LED lighting, the NTB22N06 delivers superior performance and quality that will exceed your expectations. Upgrade your designs with the Onsemi NTB22N06 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides good durability and resistance to heat, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and lower resistance compared to P-channel transistors, offering efficient switching capabilities.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient operation in circuits that require rapid on/off transitions.

Maximum Pulsed Drain Current (IDM): 66 A

High pulsated drain current rating allows the transistor to handle sudden surges of current, making it suitable for applications with varying load demands.

Maximum Drain-Source On Resistance: 0.06 ohm

Low drain-source on resistance results in minimal power loss and heat generation, improving the efficiency of the transistor in switching operations.

Technical Specifications

Power Field Effect Transistors (FET) NTB22N06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

66 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB22N06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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