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NTB22N06L

Onsemi

NTB22N06L by Onsemi

NTB22N06L by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 66A IDM, and 0.065 ohm RDS. Ideal for SWITCHING applications due to its 175 °C Max Temp and 72mJ EAS rating. RECTANGULAR package with GULL WING terminals makes it suitable for surface mount designs.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 530 parts In-Stock

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-

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$0.132

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$0.110

10k+ parts

$0.098

530

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$0.132

$0.110

$0.098

Distributors (In-Stock)

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Digiode

USA . 771 parts In-Stock

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$0.103

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$0.103

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Vyrian

USA . 8,107 parts In-Stock

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Prism Electronics

USA . 760 parts In-Stock

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Corphita

USA . 1,881 parts In-Stock

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$0.097

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$0.097

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Corohmni

South Africa . 183 parts In-Stock

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$0.108

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QUARKTWIN TECHNOLOGY LTD

USA . 29,376 parts In-Stock

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Kulean Microsystems

USA . 7,423 parts In-Stock

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Problanco Electronics

Mexico . 6,046 parts In-Stock

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TANS Electronics

Latvia . 5,190 parts In-Stock

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SupplyDigital Components

Austria . 2,271 parts In-Stock

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Perfect Parts

USA . 851 parts In-Stock

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UHIMA Technologies

Türkiye . 433 parts In-Stock

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Overview

Unlock the power of reliable switching with the NTB22N06L by Onsemi. Designed with superior quality and precision, this N-channel Power FET offers unparalleled performance for a variety of applications. From automotive to industrial, this transistor is your go-to solution for efficient power management. With Onsemi's proven track record of excellence, you can trust that this product delivers the value, benefits, and advantages you need to take your projects to the next level. Choose the NTB22N06L and experience the difference in quality and reliability today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the FET, ensuring longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-state resistance and higher switching speeds compared to P-Channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse current flow, enhancing the safety and efficiency of the circuit.

Transistor Application: SWITCHING

Designed for switching applications, this FET is capable of handling rapid changes in current flow, making it ideal for power management in various electronic devices.

Surface Mount: YES

Surface-mount FETs are space-efficient and easy to work with during assembly, making them a popular choice for compact electronic designs.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60 V, this FET can safely operate in circuits with higher voltage requirements without the risk of damage.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into circuit layouts and PCB designs, optimizing space utilization.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and secure solder connections, ensuring reliable electrical contact in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage to turn ON, offering better control over the switching operation and power consumption in the circuit.

Maximum Pulsed Drain Current (IDM): 66 A

The high pulsed drain current capability allows the FET to handle short-term current spikes or surges without compromising performance or reliability.

Technical Specifications

Power Field Effect Transistors (FET) NTB22N06L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

66 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB22N06L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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