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NTB23N03RT4G

Onsemi

NTB23N03RT4G by Onsemi

NTB23N03RT4G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage and 60A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has a max power dissipation of 37.5W and can handle up to 6A drain current.

Median Price

$0.157

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,894 parts In-Stock

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$0.170

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$0.141

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$0.125

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$0.125

DigiKey

USA . 11,894 parts In-Stock

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$0.140

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$0.140

Verical

USA . 11,894 parts In-Stock

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$0.157

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$0.157

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Digiode

USA . 2,430 parts In-Stock

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$0.132

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$0.132

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Vyrian

USA . 861 parts In-Stock

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$0.139

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ComSIT Distribution GmbH

Germany . 666 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 18 parts In-Stock

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Corphita

USA . 1,939 parts In-Stock

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$0.125

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$0.125

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Corohmni

South Africa . 359 parts In-Stock

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$0.139

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359

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Kepictronics

USA . 20,000 parts In-Stock

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Continental Prestige Electronics

USA . 11,894 parts In-Stock

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$0.219

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Problanco Electronics

Mexico . 6,828 parts In-Stock

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Kulean Microsystems

USA . 6,752 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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SupplyDigital Components

Austria . 1,927 parts In-Stock

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TANS Electronics

Latvia . 1,271 parts In-Stock

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UHIMA Technologies

Türkiye . 967 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 315 parts In-Stock

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Glotronic Ltd.

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Overview

Unleash the power of efficiency and reliability with the NTB23N03RT4G from Onsemi. Crafted with precision and quality, this N-CHANNEL Power FET is designed for switching applications, offering a seamless performance like no other. With a maximum drain current of 23 A and a low on-resistance of 0.06 ohm, this transistor ensures optimal power management in a compact package. Say goodbye to inefficiencies and hello to a new level of performance with the NTB23N03RT4G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the transistor, making it durable and reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and lower resistance, resulting in efficient performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier circuit designs and protection against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast and efficient control of current flow.

Surface Mount: YES

Surface mount design simplifies PCB assembly and saves space, making it ideal for compact electronic devices.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltage applications with ease.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and mounting on PCBs, optimizing space usage.

Terminal Form: GULL WING

Gull wing terminals are suitable for surface mount applications, providing strong mechanical support.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high switching speeds and lower power consumption, ideal for efficient performance.

Maximum Pulsed Drain Current (IDM): 60 A

High pulsed drain current rating allows for handling momentary high current spikes without damage.

Maximum Drain Current (Abs) (ID): 23 A

High drain current rating ensures the transistor can handle continuous current flow without overheating.

No. of Terminals: 2

Having 2 terminals simplifies the circuit design and installation process.

Maximum Power Dissipation (Abs): 37.5 W

High power dissipation capability ensures the transistor can handle high power applications without failure.

Package Style (Meter): SMALL OUTLINE

Small outline package design saves space and allows for efficient heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and stable performance over a wide range of operating conditions.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating of 150 °C, this transistor can withstand demanding temperature environments.

Transistor Element Material: SILICON

Silicon material ensures good performance and durability for the transistor, making it a reliable choice for various applications.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring reliable electrical connections.

Maximum Drain Current (ID): 6 A

With a maximum drain current of 6A, this transistor can handle moderate current loads effectively.

Maximum Drain-Source On Resistance: 0.06 ohm

Low drain-source on resistance ensures minimal power losses and efficient current flow in the circuit.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and reduces the risk of errors during installation.

Case Connection: DRAIN

Drain case connection allows for easy heat dissipation and efficient thermal management during operation.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, ensures proper soldering and reliability in manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, ensures proper soldering and reliability during assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) NTB23N03RT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB23N03RT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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