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NTB125N02RT4G

Onsemi

NTB125N02RT4G by Onsemi

NTB125N02RT4G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage and 250A IDM. Ideal for SWITCHING applications, it features a built-in diode, 0.0062 ohm RDS(on), and 120mJ EAS rating. Suitable for surface mount with GULL WING terminals, it operates in ENHANCEMENT MODE up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,887 parts In-Stock

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Digiode

USA . 965 parts In-Stock

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Sea View Technologies

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Bristol Electronics

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AZTECH Wire

Italy . 1,085 parts In-Stock

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Kepictronics

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Kulean Microsystems

USA . 4,645 parts In-Stock

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SupplyDigital Components

Austria . 4,505 parts In-Stock

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Problanco Electronics

Mexico . 3,824 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,351 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 447 parts In-Stock

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Corohmni

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Overview

Experience the superior performance and reliability of the Onsemi NTB125N02RT4G Power Field Effect Transistor. With a focus on quality and innovation, Onsemi delivers products that exceed industry standards. Ideal for switching applications, this N-Channel transistor offers seamless operation and efficiency. From its high pulsing capacity to its low resistance, this transistor provides a valuable solution for your power needs. Trust Onsemi to deliver cutting-edge technology that enhances your projects and increases productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current-carrying capability compared to P-channel FETs, making them efficient for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, enhancing the reliability of the switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such scenarios.

Surface Mount: YES

The surface mount capability makes installation easy and convenient, especially for compact electronic devices.

Maximum Pulsed Drain Current (IDM): 250 A

High pulsed drain current rating allows the FET to handle sudden surges in current, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 113.6 W

With high power dissipation capability, this FET can efficiently manage heat generation during operation, maintaining optimal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This advanced technology offers high performance, low power consumption, and improved reliability for the FET.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB125N02RT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

125 A

Maximum Drain Current (ID):

95 A

Maximum Drain-Source On Resistance:

.0062 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

250 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB125N02RT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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