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NTB15N40

Onsemi

NTB15N40 by Onsemi

NTB15N40 by Onsemi is a N-CHANNEL FET with 400V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 53A and EAS of 675mJ, suitable for high-power operations. With a 0.26 ohm RDS(on), this MOSFET operates in ENHANCEMENT MODE at up to 150 °C, making it versatile for various power electronics designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,346 parts In-Stock

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Digiode

USA . 1,410 parts In-Stock

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Problanco Electronics

Mexico . 7,021 parts In-Stock

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Corphita

USA . 1,844 parts In-Stock

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TANS Electronics

Latvia . 1,721 parts In-Stock

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Kulean Microsystems

USA . 1,452 parts In-Stock

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SupplyDigital Components

Austria . 1,150 parts In-Stock

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UHIMA Technologies

Türkiye . 444 parts In-Stock

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Corohmni

South Africa . 105 parts In-Stock

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Overview

Experience superior performance and reliability with the NTB15N40 Power FET by Onsemi. Designed with precision and expertise, this N-channel transistor boasts a single configuration with a built-in diode, making it ideal for switching applications. With a minimum DS breakdown voltage of 400V and maximum pulsed drain current of 53A, this transistor ensures efficiency and durability in operation. Trust Onsemi's quality and innovation to deliver the best-in-class products for your electronic needs. Unlock the potential of your projects with the NTB15N40 and experience unparalleled value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the transistor, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have faster switching speeds and higher efficiency compared to P-channel transistors, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves efficiency and reliability in switching applications, offering better performance and protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high performance and efficiency in turning devices on and off.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and improving overall design.

Minimum DS Breakdown Voltage: 400 V

With a high breakdown voltage, this transistor can handle higher voltages without failure, ensuring reliability in demanding applications.

Maximum Pulsed Drain Current (IDM): 53 A

With a high pulsed drain current rating, this transistor can handle large current surges, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 202 W

The high power dissipation rating allows for efficient heat management, ensuring the transistor can handle high power loads without overheating.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB15N40 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

675 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

400 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

53 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB15N40 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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