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NTB12N50T4

Onsemi

NTB12N50T4 by Onsemi

NTB12N50T4 by Onsemi is a N-CHANNEL FET with 500V DS breakdown voltage, 42A IDM, and 0.5 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 202W.

Median Price

$1.475

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,914 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.180

10k+ parts

$1.110

3,914

-

$1.320

$1.180

$1.110

DigiKey

USA . 3,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.740

10k+ parts

-

3,914

-

-

$1.740

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Verical

USA . 3,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.475

10k+ parts

-

3,914

-

-

$1.475

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 301 parts In-Stock

1+ parts

$1.190

100+ parts

-

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301

$1.190

-

-

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Digiode

USA . 1,709 parts In-Stock

1+ parts

$1.396

100+ parts

-

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10k+ parts

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1,709

$1.396

-

-

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DigiKey Marketplace

USA . 3,989 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

-

10k+ parts

-

3,989

-

$1.530

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 126 parts In-Stock

1+ parts

$1.190

100+ parts

-

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126

$1.190

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-

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Corphita

USA . 2,104 parts In-Stock

1+ parts

$1.323

100+ parts

-

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2,104

$1.323

-

-

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Microchip USA

USA . 2,378 parts In-Stock

1+ parts

$9.165

100+ parts

-

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2,378

$9.165

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 13,681 parts In-Stock

1+ parts

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13,681

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TANS Electronics

Latvia . 7,551 parts In-Stock

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7,551

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Kulean Microsystems

USA . 7,232 parts In-Stock

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7,232

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Continental Prestige Electronics

USA . 3,989 parts In-Stock

1+ parts

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100+ parts

$1.190

1k+ parts

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3,989

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$1.190

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SupplyDigital Components

Austria . 3,924 parts In-Stock

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3,924

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Problanco Electronics

Mexico . 2,739 parts In-Stock

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2,739

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UHIMA Technologies

Türkiye . 517 parts In-Stock

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517

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Overview

Experience the power of efficiency with the NTB12N50T4 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality Power Field Effect Transistors that are perfect for switching applications. With a built-in diode and N-channel configuration, this transistor offers enhanced performance and reliability. Whether you're looking to improve your electronic devices or enhance your systems, the NTB12N50T4 provides unparalleled value, benefit, and advantage to customers seeking top-notch quality and functionality. Trust Onsemi to deliver excellence in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components, making the transistor suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves efficiency and protects the circuit from voltage spikes, making the transistor suitable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast switching speeds and low on-resistance for efficient performance.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration onto PCBs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 500 V

The high breakdown voltage makes this transistor suitable for high voltage applications where reliability and durability are crucial.

Maximum Pulsed Drain Current (IDM): 42 A

The high pulsed drain current rating allows the transistor to handle high current spikes without any issues, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 202 W

With a high power dissipation rating, this transistor can handle high power loads without overheating, ensuring reliable performance under heavy loads.

Maximum Drain-Source On Resistance: 0.5 ohm

The low on-resistance of the transistor results in reduced power loss and improved efficiency, making it suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can withstand high temperatures without failing, making it suitable for harsh environment applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB12N50T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

720 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

42 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB12N50T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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