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NSTB1005DXV5T5

Onsemi

NSTB1005DXV5T5 by Onsemi

NSTB1005DXV5T5 by Onsemi is a Small Signal BJT with NPN and PNP polarity, 2 elements in cascaded configuration. It has a max power dissipation of 0.5W, hFE of 80, Vce of 50V, and Ic of 0.1A making it ideal for switching applications. This surface-mount transistor comes in a rectangular package with 5 terminals and built-in resistors for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,249 parts In-Stock

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Vyrian

USA . 460 parts In-Stock

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TANS Electronics

Latvia . 7,419 parts In-Stock

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Problanco Electronics

Mexico . 6,341 parts In-Stock

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Kulean Microsystems

USA . 3,741 parts In-Stock

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SupplyDigital Components

Austria . 3,241 parts In-Stock

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Corphita

USA . 1,165 parts In-Stock

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Corohmni

South Africa . 162 parts In-Stock

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UHIMA Technologies

Türkiye . 57 parts In-Stock

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Overview

Unleash the power of innovation with the NSTB1005DXV5T5 by Onsemi. Crafted with precision and expertise, this Small Signal Bipolar Junction Transistor offers unparalleled quality and performance. Whether you need seamless switching capabilities or reliable cascaded configuration, this product delivers. With its NPN and PNP polarity options, built-in resistor elements, and high DC current gain, the NSTB1005DXV5T5 is your go-to solution for a wide range of applications. Trust Onsemi to provide cutting-edge technology that enhances your projects and unlocks endless possibilities. Elevate your designs with the NSTB1005DXV5T5 – where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN AND PNP

Having both NPN and PNP types allows for versatility in circuit design and usage scenarios.

Configuration: CASCADED, 2 ELEMENTS WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space in the overall design.

Transistor Application: SWITCHING

Ideal for applications where fast switching speeds are required, making it suitable for various electronic devices.

Surface Mount: YES

Easy to mount on a PCB, saving assembly time and reducing overall size of the electronic device.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on a PCB and saves space in the design.

Terminal Form: FLAT

The flat terminal form makes it easy to solder and ensures a secure connection.

Maximum Power Dissipation (Abs): 0.5 W

With a maximum power dissipation of 0.5W, this transistor can handle moderate power loads efficiently.

Minimum DC Current Gain (hFE): 80

A high DC current gain ensures accurate amplification and control in various applications.

Maximum Collector-Emitter Voltage: 50 V

With a maximum voltage of 50V, this transistor can handle a wide range of voltage inputs.

Transistor Element Material: SILICON

Silicon is a reliable and commonly used material for transistors, ensuring durability and performance.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1A, this transistor can handle moderate current loads effectively.

Terminal Finish: TIN

The tin terminal finish provides a reliable connection and prevents oxidation, ensuring long-term performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit design and connection options.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this transistor can withstand high-temperature assembly processes.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSTB1005DXV5T5 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSTB1005DXV5T5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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