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NLX2G32DMUTCG

Onsemi

NLX2G32DMUTCG by Onsemi

NLX2G32DMUTCG by Onsemi is a CMOS Logic Gate with 2 functions and inputs, operating at 1.8/5V supplies. It features a propagation delay of 10.5ns, suitable for industrial applications requiring fast signal processing in compact designs. This small-outline package with nickel/palladium/gold terminals is ideal for surface-mount PCBs where space is limited.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 12,175 parts In-Stock

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Digiode

USA . 2,471 parts In-Stock

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AZTECH Wire

Italy . 110 parts In-Stock

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Problanco Electronics

Mexico . 8,098 parts In-Stock

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TANS Electronics

Latvia . 5,241 parts In-Stock

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SupplyDigital Components

Austria . 4,853 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 1,945 parts In-Stock

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UHIMA Technologies

Türkiye . 838 parts In-Stock

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Microchip USA

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Overview

Discover the power and precision of the NLX2G32DMUTCG by Onsemi, a high-quality logic gate that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product is perfect for a variety of applications. With its fast propagation delay and low power consumption, this logic gate delivers unmatched value and efficiency to customers. Whether you're designing circuits for industrial automation or consumer electronics, the NLX2G32DMUTCG provides the superior functionality and versatility you need to bring your projects to life. Elevate your designs with the NLX2G32DMUTCG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 10.5 ns

With a fast propagation delay of 10.5 ns at nominal supply, this logic gate ensures efficient and high-speed performance.

Surface Mount: YES

Being surface mountable allows for easy installation and integration onto circuit boards.

No. of Functions: 2

Having 2 functions in a single unit increases the versatility and functionality of the logic gate.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V makes it compatible with a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish ensures good conductivity and resistance to corrosion.

Temperature Grade: INDUSTRIAL

Being designed for industrial temperature range makes this logic gate suitable for harsh operating environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Logic Gates NLX2G32DMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.95 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G32DMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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