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NLX2G32CMX1TCG

Onsemi

NLX2G32CMX1TCG by Onsemi

NLX2G32CMX1TCG by Onsemi is a logic gate with 2 functions and inputs, operating at 1.8V. With a propagation delay of 10.5ns, it's ideal for industrial applications requiring fast response times in a small outline package. This surface-mount device has a wide temperature range from -40 to 85 °C, making it suitable for various environments.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,190 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

4,190

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$0.132

$0.110

$0.098

DigiKey

USA . 4,190 parts In-Stock

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-

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$0.170

4,190

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$0.170

Verical

USA . 4,190 parts In-Stock

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$0.122

4,190

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$0.122

Distributors (In-Stock)

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Digiode

USA . 324 parts In-Stock

1+ parts

$0.103

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324

$0.103

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Chip Stock

USA . 21,000 parts In-Stock

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Vyrian

USA . 6,381 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,439 parts In-Stock

1+ parts

$0.097

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1,439

$0.097

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Vigor

Singapore . 399 parts In-Stock

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$0.100

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399

$0.100

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Component Stockers USA

USA . 4,627 parts In-Stock

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$0.110

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$0.110

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$0.100

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4,627

$0.110

$0.110

$0.100

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Corohmni

South Africa . 375 parts In-Stock

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$0.114

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$0.114

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AZTECH Wire

Italy . 411 parts In-Stock

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$16.380

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TANS Electronics

Latvia . 8,018 parts In-Stock

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Problanco Electronics

Mexico . 6,793 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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SupplyDigital Components

Austria . 4,577 parts In-Stock

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Continental Prestige Electronics

USA . 4,190 parts In-Stock

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$0.094

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4,190

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Kulean Microsystems

USA . 1,906 parts In-Stock

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UHIMA Technologies

Türkiye . 832 parts In-Stock

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Microchip USA

USA . 272 parts In-Stock

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Overview

Discover the exceptional quality of the NLX2G32CMX1TCG logic gates by Onsemi, renowned for their reliability and precision engineering. Perfect for a wide range of applications, these logic gates offer seamless integration and unmatched performance. With a nominal supply voltage of 1.8V and a propagation delay of just 10.5ns, this product delivers unparalleled speed and efficiency. Experience the value and benefits of Onsemi's cutting-edge technology with the NLX2G32CMX1TCG logic gates - your key to unlocking endless possibilities in electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards.

No. of Functions: 2

Having multiple functions in a single component helps in saving space and simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 1.8

The low supply voltage of 1.8V is suitable for low-power applications.

Propagation Delay (tpd): 10.5 ns

The low propagation delay of 10.5 ns ensures fast signal processing.

Maximum Operating Temperature: 85 °C

The product can operate efficiently at high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for use in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides good conductivity and corrosion resistance.

Width: 1 mm

The compact width of 1mm helps in saving space on the circuit board.

Minimum Supply Voltage (Vsup): 1.65 V

The product can operate at a low minimum supply voltage of 1.65V.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and durability in harsh conditions.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and easy to handle during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

The product can handle a maximum supply voltage of 5.5V, making it versatile for different applications.

Technical Specifications

Logic Gates NLX2G32CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Propagation Delay (tpd):

10.5 ns

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G32CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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