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NLVVHC1G32DFT2G

Onsemi

NLVVHC1G32DFT2G by Onsemi

NLVVHC1G32DFT2G by Onsemi is a CMOS Logic Gate with 2 inputs, 10 ns propagation delay at 5V. It operates in temperatures from -55 to 125 °C and has a max power supply current of 0.04 mA. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.394

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$0.120

100+ parts

$0.059

1k+ parts

$0.048

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1,000

$0.120

$0.059

$0.048

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Chip1Stop

Japan . 2,953 parts In-Stock

1+ parts

$0.669

100+ parts

$0.155

1k+ parts

$0.096

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2,953

$0.669

$0.155

$0.096

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Distributors (In-Stock)

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Digiode

USA . 1,595 parts In-Stock

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$0.636

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$0.636

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Flip Electronics

USA . 2,444,756 parts In-Stock

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Vyrian

USA . 5,825 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,442 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,740 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 279 parts In-Stock

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$0.460

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279

$0.460

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Corphita

USA . 1,094 parts In-Stock

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$0.602

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Corohmni

South Africa . 52 parts In-Stock

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$0.669

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52

$0.669

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Microchip USA

USA . 8,819 parts In-Stock

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$0.900

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$0.900

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AZTECH Wire

Italy . 367 parts In-Stock

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$21.290

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367

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RC Electronics

USA . 63,198 parts In-Stock

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Perfect Parts

USA . 30,124 parts In-Stock

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SupplyDigital Components

Austria . 7,923 parts In-Stock

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TANS Electronics

Latvia . 6,584 parts In-Stock

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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Kulean Microsystems

USA . 3,895 parts In-Stock

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Authorized Procurement Solutions

USA . 2,953 parts In-Stock

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GreenTree Electronics

Israel . 2,953 parts In-Stock

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ChipstoGo Electronic ltd

UK . 2,023 parts In-Stock

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Problanco Electronics

Mexico . 1,504 parts In-Stock

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UHIMA Technologies

Türkiye . 593 parts In-Stock

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Overview

Discover the superior quality and innovation of Onsemi with the NLVVHC1G32DFT2G Logic Gate. Perfect for a variety of applications, this product offers customers unmatched value and benefits. With fast propagation delay, low power consumption, and high reliability, this Logic Gate ensures optimal performance in your projects. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the package, ensuring the safety of the internal components.

Propagation Delay At Nominal Supply: 10 ns

Fast propagation delay ensures quick response times, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation and integration easy, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability, meeting automotive industry standards for ruggedness and performance.

No. of Inputs: 2

Having 2 inputs allows for versatile logic operations and increased functionality in logic gate circuits.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this logic gate compatible with standard electronic systems and easy to integrate.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures optimal performance and stability in driving connected components.

Power Supplies (V): 2/5.5

Supporting power supplies ranging from 2V to 5.5V allows for flexibility in various system configurations and power requirements.

Maximum I (ol): 8 Amp

With a maximum output current of 8A, this logic gate can drive components with higher power requirements without risk of damage.

Minimum Operating Temperature: -55 °C

Operating at temperatures as low as -55°C ensures reliable performance in extreme environmental conditions.

Technical Specifications

Logic Gates NLVVHC1G32DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

15.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLVVHC1G32DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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