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NLV74LVX14DTR2G

Onsemi

NLV74LVX14DTR2G by Onsemi

NLV74LVX14DTR2G by Onsemi is a CMOS Logic Gates IC with 6 functions, 23ns propagation delay, and operates b/w -40 to 85°C. Ideal for industrial applications, it features a small outline package with 14 terminals and a supply voltage range of 2-3.6V, making it suitable for various electronic designs.

Median Price

$0.243

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,333 parts In-Stock

1+ parts

-

100+ parts

$0.263

1k+ parts

$0.218

10k+ parts

$0.195

45,333

-

$0.263

$0.218

$0.195

Verical

USA . 45,333 parts In-Stock

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-

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$0.243

45,333

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$0.243

DigiKey

USA . 1,995 parts In-Stock

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1,995

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Mouser Electronics

USA . 1,786 parts In-Stock

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$0.195

1,786

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Distributors (In-Stock)

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Digiode

USA . 767 parts In-Stock

1+ parts

$0.204

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767

$0.204

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Nova Conductors

Japan . 50 parts In-Stock

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$0.263

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$0.263

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Vyrian

USA . 16,136 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15,877 parts In-Stock

1+ parts

$0.166

100+ parts

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$0.166

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Corphita

USA . 2,271 parts In-Stock

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$0.194

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$0.194

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Corohmni

South Africa . 214 parts In-Stock

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$0.195

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214

$0.195

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Vigor

Singapore . 681 parts In-Stock

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$0.220

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681

$0.220

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Aranea Global

USA . 100 parts In-Stock

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$0.258

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$0.247

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100

$0.258

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$0.247

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Argo Parts USA

USA . 1,743 parts In-Stock

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$0.263

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$0.255

1,743

$0.263

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$0.255

Continental Prestige Electronics

USA . 677 parts In-Stock

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$0.263

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$0.258

677

$0.263

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Microchip USA

USA . 4,310 parts In-Stock

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$1.549

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$1.549

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Problanco Electronics

Mexico . 4,070 parts In-Stock

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SupplyDigital Components

Austria . 3,442 parts In-Stock

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Kulean Microsystems

USA . 3,155 parts In-Stock

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TANS Electronics

Latvia . 1,173 parts In-Stock

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UHIMA Technologies

Türkiye . 408 parts In-Stock

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Overview

Enhance your electronic projects with the NLV74LVX14DTR2G by Onsemi! Crafted by a trusted manufacturer, this logic gate offers top-notch quality and reliability. Perfect for a wide range of applications, this product boasts 6 functions and a low propagation delay of 23ns, making it ideal for high-speed operations. With a temperature grade of INDUSTRIAL and AEC-Q100 screening level, this logic gate ensures optimal performance in harsh environments. Invest in the NLV74LVX14DTR2G today and experience seamless integration, efficiency, and precision in your designs. Unlock endless possibilities with this exceptional product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to damage, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a 3.3V supply voltage provides a good balance between performance and power consumption for various applications.

Propagation Delay (tpd): 23 ns

With a low propagation delay of 23 ns, this logic gate offers fast response times, making it suitable for high-speed operations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in extreme environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate efficient and reliable for various applications.

Technical Specifications

Logic Gates NLV74LVX14DTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

23 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74LVX14DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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