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NLV74VHC1GT50DTT1G

Onsemi

NLV74VHC1GT50DTT1G by Onsemi

NLV74VHC1GT50DTT1G by Onsemi is a 5-terminal CMOS Logic Gate with 10ns propagation delay at 5V. It operates in the temperature range of -55 to 125°C, suitable for military applications. The package style is small outline, thin profile, shrink pitch, making it ideal for compact designs requiring fast signal processing.

Median Price

$0.151

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

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$0.144

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$0.136

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$0.123

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$0.144

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$0.123

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Arrow

USA . 667 parts In-Stock

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$0.221

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$0.151

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$0.129

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$0.120

667

$0.221

$0.151

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$0.120

DigiKey

USA . 51,000 parts In-Stock

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$0.140

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$0.140

Flip Electronics (Authorized)

USA . 51,000 parts In-Stock

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Mouser Electronics

USA . 2,950 parts In-Stock

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$0.127

Verical

USA . 667 parts In-Stock

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$0.154

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$0.129

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$0.120

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$0.120

Chip1Stop

Japan . 317 parts In-Stock

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Element14

Singapore . 2 parts In-Stock

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$0.227

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$0.168

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$0.136

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$0.168

$0.136

Distributors (In-Stock)

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Digiode

USA . 345 parts In-Stock

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$0.137

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345

$0.137

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Nova Conductors

Japan . 600 parts In-Stock

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$0.175

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Flip Electronics

USA . 51,000 parts In-Stock

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Vyrian

USA . 11,781 parts In-Stock

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Chip Stock

USA . 4,500 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 11,837 parts In-Stock

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$0.108

100+ parts

$0.105

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$0.105

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11,837

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$0.105

$0.105

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Corohmni

South Africa . 225 parts In-Stock

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$0.114

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Corphita

USA . 1,897 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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$0.172

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$0.165

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$0.172

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Argo Parts USA

USA . 1,860 parts In-Stock

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$0.175

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$0.170

1,860

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Ampacity Inc.

Singapore . 11,724 parts In-Stock

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$0.235

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Vigor

Singapore . 798 parts In-Stock

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$0.460

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Microchip USA

USA . 9,131 parts In-Stock

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$1.057

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Aztec Data Supply Inc.

USA . 179 parts In-Stock

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$30.370

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Lixinc

USA . 19,633 parts In-Stock

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Problanco Electronics

Mexico . 8,195 parts In-Stock

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Kulean Microsystems

USA . 4,813 parts In-Stock

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TANS Electronics

Latvia . 3,395 parts In-Stock

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SupplyDigital Components

Austria . 2,991 parts In-Stock

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Continental Prestige Electronics

USA . 1,153 parts In-Stock

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UHIMA Technologies

Türkiye . 65 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the NLV74VHC1GT50DTT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality logic gates that are essential for a wide range of applications. Whether you're working on automotive electronics or consumer devices, this product offers a fast propagation delay and low power consumption, making it a valuable addition to any project. Trust Onsemi to provide cutting-edge technology and exceptional value with the NLV74VHC1GT50DTT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material for the package body makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 10 ns

The low propagation delay of 10 ns ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient integration into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides compatibility with standard voltage levels, making it versatile for a wide range of applications.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95 mm allows for high-density mounting, enabling compact design and efficient use of space on circuit boards.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates NLV74VHC1GT50DTT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

25.5 ns

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NLV74VHC1GT50DTT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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