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NLV74HC14ADTR2G

Onsemi

NLV74HC14ADTR2G by Onsemi

NLV74HC14ADTR2G by Onsemi is a logic gate with 6 functions and a propagation delay of 22 ns. It operates at a nominal voltage of 5V and is suitable for applications in the military, automotive, and industrial sectors.

Median Price

$6.664

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,268 parts In-Stock

1+ parts

$15.820

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2,268

$15.820

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Arrow

USA . 4,890 parts In-Stock

1+ parts

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4,890

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Verical

USA . 4,890 parts In-Stock

1+ parts

-

100+ parts

$0.289

1k+ parts

$0.175

10k+ parts

-

4,890

-

$0.289

$0.175

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Rochester

USA . 23 parts In-Stock

1+ parts

-

100+ parts

$0.224

1k+ parts

$0.186

10k+ parts

$0.166

23

-

$0.224

$0.186

$0.166

DigiKey

USA . 23 parts In-Stock

1+ parts

-

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$13.040

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23

-

$13.040

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Distributors (In-Stock)

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Digiode

USA . 1,703 parts In-Stock

1+ parts

$0.174

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-

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1,703

$0.174

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.238

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200

$0.238

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Chip Stock

USA . 67,000 parts In-Stock

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67,000

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Vyrian

USA . 6,049 parts In-Stock

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6,049

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Cyclops Electronics Ltd

UK . 2,820 parts In-Stock

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2,820

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NAC Semi

USA . 2,500 parts In-Stock

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$0.278

2,500

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$0.278

Distributors (Availability)

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Ampacity Inc.

Singapore . 2,811 parts In-Stock

1+ parts

$0.156

100+ parts

-

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2,811

$0.156

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Corphita

USA . 1,131 parts In-Stock

1+ parts

$0.165

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1,131

$0.165

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Corohmni

South Africa . 63 parts In-Stock

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$0.183

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63

$0.183

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Continental Prestige Electronics

USA . 6,306 parts In-Stock

1+ parts

$0.238

100+ parts

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$0.233

6,306

$0.238

-

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$0.233

Argo Parts USA

USA . 4,647 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

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10k+ parts

$0.231

4,647

$0.238

-

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$0.231

Vigor

Singapore . 328 parts In-Stock

1+ parts

$0.690

100+ parts

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328

$0.690

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Microchip USA

USA . 178 parts In-Stock

1+ parts

$3.440

100+ parts

$3.430

1k+ parts

$3.430

10k+ parts

$3.420

178

$3.440

$3.430

$3.430

$3.420

Perfect Parts

USA . 17,947 parts In-Stock

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17,947

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SupplyDigital Components

Austria . 3,308 parts In-Stock

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3,308

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Eastek

USA . 2,500 parts In-Stock

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$0.250

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2,500

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$0.250

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Authorized Procurement Solutions

USA . 2,268 parts In-Stock

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2,268

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TANS Electronics

Latvia . 2,103 parts In-Stock

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2,103

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iodParts Technologies Inc.

India . 1,820 parts In-Stock

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1,820

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Problanco Electronics

Mexico . 1,533 parts In-Stock

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Kulean Microsystems

USA . 1,002 parts In-Stock

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UHIMA Technologies

Türkiye . 899 parts In-Stock

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899

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Netroflash

USA . 500 parts In-Stock

1+ parts

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$0.233

1k+ parts

$0.226

10k+ parts

$0.221

500

-

$0.233

$0.226

$0.221

Overview

Experience superior quality and performance with the NLV74HC14ADTR2G by Onsemi. As a trusted manufacturer in the industry, Onsemi is known for delivering top-notch products. This logic gates category offers versatile applications and is perfect for various projects. But what sets this product apart is its incredible value and benefits for customers. With its fast propagation delay and high-speed operation, this device ensures efficient and reliable performance. Plus, its compact design and surface mount capability make it easy to integrate into your circuits. Don't settle for less when you can have excellence with the NLV74HC14ADTR2G by Onsemi.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the logic gates, making them long-lasting and resistant to impact.

Propagation Delay At Nominal Supply:

22 ns - With a low propagation delay, this product ensures fast and efficient signal processing, making it ideal for high-speed applications.

Surface Mount:

YES - The surface mount feature allows for easy and convenient installation, saving time and effort during assembly.

No. of Functions:

6 - With multiple functions available in a single package, this product offers versatility and cost-effectiveness, reducing the need for multiple components.

Screening Level:

AEC-Q100 - Meeting AEC-Q100 standards ensures a high level of reliability and performance, making this product suitable for automotive and other demanding environments.

No. of Inputs:

1 - This logic gate provides a single input option, simplifying circuit design and reducing complexity.

Package Shape:

RECTANGULAR - The rectangular shape enables secure and efficient PCB placement, facilitating space-saving and optimal circuit layout.

Nominal Supply Voltage / Vsup:

5V - Operating at a common and standard voltage level, this product is compatible with a wide range of systems and power supplies.

Load Capacitance (CL):

50 pF - The low load capacitance allows for improved signal integrity and reduces the risk of signal distortion in high-capacitance environments.

Power Supplies (V):

2/6 - This product offers flexibility by operating at both 2V and 6V supply voltages, accommodating various power requirements.

No. of Terminals:

14 - With 14 terminals, this logic gate provides ample connection options, enabling easy integration into complex circuits.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The small outline, thin profile, and shrink pitch design of the package contribute to space-saving, making it suitable for compact electronic devices.

Maximum I (ol):

4 Amp - With a maximum output current of 4 Amps, this logic gate can handle high current loads, offering robust performance in demanding applications.

Propagation Delay (tpd):

110 ns - This logic gate ensures minimal signal delay, resulting in quick response times and efficient overall system performance.

Maximum Operating Temperature:

125 °C - With a maximum operating temperature of 125°C, this product can withstand elevated temperatures, ensuring reliability in harsh environments.

Minimum Operating Temperature:

55 °C - The wide temperature range of -55 to 125°C makes this logic gate suitable for both extreme hot and cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - The terminal finish of nickel, palladium, and gold provides corrosion resistance, ensuring long-term reliability and excellent electrical performance.

Terminal Position:

DUAL - With dual terminal positions, this logic gate allows for multiple mounting options, enhancing flexibility during installation.

Maximum Seated Height:

1.2 mm - The low maximum seated height makes this logic gate suitable for space-constrained applications, where component height is critical.

Width:

4.4 mm - The compact width of this logic gate allows for efficient use of PCB space, enabling dense circuit designs.

Minimum Supply Voltage (Vsup):

2 V - With a low minimum supply voltage of 2V, this logic gate can be operated in low-power applications or battery-powered systems.

Maximum Time At Peak Reflow Temperature (s):

30 - This product offers a maximum reflow time of 30 seconds, ensuring proper soldering and optimal manufacturing processes.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature of 260°C ensures reliable soldering and good solder joint integrity during assembly.

Length:

5 mm - With a compact length of 5mm, this logic gate allows for efficient use of the PCB area, accommodating space-constrained designs.

Temperature Grade:

MILITARY - Operating within military-grade temperature specifications, this logic gate offers high reliability and resilience in extreme operating conditions.

Schmitt Trigger:

YES - Equipped with a Schmitt trigger, this logic gate provides noise immunity and improved signal stability, making it suitable for use in noisy environments.

Technology:

CMOS - Utilizing CMOS technology, this logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages.

Terminal Form:

GULL WING - The gull-wing terminal form ensures secure solder joints, simplifies manual or automated assembly, and enhances the overall mechanical strength of the product.

Packing Method:

TR - The TR packing method, typically tape and reel, offers convenient storage, transportation, and automated pick-and-place for large-scale manufacturing processes.

Terminal Pitch:

0.65 mm - With a small terminal pitch of 0.65mm, this logic gate allows for higher integration density on PCBs, contributing to miniaturization and space efficiency.

Moisture Sensitivity Level (MSL):

1 - Having an MSL of 1 indicates that this logic gate is moisture-sensitive and requires proper handling and storage to prevent moisture-related issues.

Maximum Supply Voltage (Vsup):

6 V - With a maximum supply voltage of 6V, this logic gate can accommodate a wide range of power supplies, ensuring compatibility with various systems and applications.

Technical Specifications

Logic Gates NLV74HC14ADTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC14ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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