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NLV74HC03ADR2G

Onsemi

NLV74HC03ADR2G by Onsemi

NLV74HC03ADR2G by Onsemi is a CMOS Logic Gates IC with 4 functions, 36 ns propagation delay at 5V. It has dual terminals, open-drain output, and AEC-Q100 screening level. Ideal for military-grade applications requiring fast signal processing in small outline packages.

Median Price

$0.180

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 96,776 parts In-Stock

1+ parts

-

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$0.180

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$0.149

10k+ parts

$0.133

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$0.180

$0.149

$0.133

DigiKey

USA . 96,776 parts In-Stock

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$0.230

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$0.230

Verical

USA . 61,826 parts In-Stock

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$0.167

61,826

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$0.167

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Chip Stock

USA . 80,000 parts In-Stock

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Vyrian

USA . 6,214 parts In-Stock

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Digiode

USA . 2,211 parts In-Stock

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Vigor

Singapore . 511 parts In-Stock

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$0.210

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511

$0.210

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Microchip USA

USA . 4,915 parts In-Stock

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$1.132

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$1.132

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Andel Nordic

Denmark . 2,111 parts In-Stock

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$7.880

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$5.513

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$5.513

2,111

$7.880

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$5.513

$5.513

AZTECH Wire

Italy . 781 parts In-Stock

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$11.550

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QUARKTWIN TECHNOLOGY LTD

USA . 25,062 parts In-Stock

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Kulean Microsystems

USA . 5,933 parts In-Stock

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SupplyDigital Components

Austria . 4,636 parts In-Stock

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Problanco Electronics

Mexico . 2,218 parts In-Stock

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TANS Electronics

Latvia . 1,554 parts In-Stock

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Corphita

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Corohmni

South Africa . 467 parts In-Stock

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UHIMA Technologies

Türkiye . 462 parts In-Stock

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Overview

Discover the reliable and high-quality NLV74HC03ADR2G logic gates by Onsemi, designed to meet the needs of a wide range of applications. With a durable plastic/epoxy package body material and AEC-Q100 screening level, this product ensures consistent performance in demanding environments. Offering 4 functions and 2 inputs, it provides flexibility and efficiency in circuit design. Customers can trust in the precision and dependability of Onsemi's technology, making the NLV74HC03ADR2G an essential component for their projects. Experience seamless integration and superior functionality with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body makes the product lightweight and durable, ideal for portable and long-lasting applications.

Propagation Delay At Nominal Supply: 36 ns

The low propagation delay of 36 ns ensures fast signal processing, making this logic gate suitable for high-speed applications where quick responses are required.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, saving space and facilitating automated assembly processes.

No. of Functions: 4

With multiple functions in a single component, this logic gate offers versatility and efficiency in circuit design, reducing the need for additional components.

No. of Inputs: 2

Having 2 input channels provides flexibility in implementing logical operations, allowing for different input combinations to achieve desired output results.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this logic gate compatible with standard electronics and power sources, ensuring easy integration into existing systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF indicates the ability of the logic gate to drive external loads efficiently, contributing to stable signal transmission and reduced signal distortion.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C enables reliable performance in harsh environmental conditions or applications where elevated temperatures are expected.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures functionality in cold environments, making this logic gate suitable for a wide range of operating conditions.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital systems, making this logic gate efficient and versatile.

Technical Specifications

Logic Gates NLV74HC03ADR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

180 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74HC03ADR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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