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NLV74HC03ADTR2G

Onsemi

NLV74HC03ADTR2G by Onsemi

NLV74HC03ADTR2G by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 36 ns propagation delay at 5V. Ideal for military applications due to AEC-Q100 screening level and -55 to 125 °C operating temperature range. Package style: SOIC-14, suitable for surface mount assembly.

Median Price

$0.197

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 69,750 parts In-Stock

1+ parts

-

100+ parts

$0.197

1k+ parts

$0.164

10k+ parts

$0.146

69,750

-

$0.197

$0.164

$0.146

DigiKey

USA . 69,750 parts In-Stock

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-

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$0.250

69,750

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$0.250

Verical

USA . 37,250 parts In-Stock

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$0.183

37,250

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$0.183

Distributors (In-Stock)

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Digiode

USA . 61 parts In-Stock

1+ parts

$0.154

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61

$0.154

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Vyrian

USA . 1,541 parts In-Stock

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$0.162

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1,541

$0.162

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Chip Stock

USA . 31,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,758 parts In-Stock

1+ parts

$0.146

100+ parts

-

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1,758

$0.146

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Component Stockers USA

USA . 60,809 parts In-Stock

1+ parts

$0.160

100+ parts

$0.150

1k+ parts

$0.140

10k+ parts

$0.140

60,809

$0.160

$0.150

$0.140

$0.140

Corohmni

South Africa . 349 parts In-Stock

1+ parts

$0.162

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349

$0.162

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Vigor

Singapore . 345 parts In-Stock

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$0.210

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345

$0.210

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$17.237

100+ parts

$15.686

1k+ parts

$14.134

10k+ parts

-

1,000

$17.237

$15.686

$14.134

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Continental Prestige Electronics

USA . 69,750 parts In-Stock

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$0.194

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69,750

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$0.194

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SupplyDigital Components

Austria . 8,047 parts In-Stock

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Problanco Electronics

Mexico . 7,717 parts In-Stock

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Kulean Microsystems

USA . 5,466 parts In-Stock

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TANS Electronics

Latvia . 2,073 parts In-Stock

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Microchip USA

USA . 569 parts In-Stock

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569

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UHIMA Technologies

Türkiye . 214 parts In-Stock

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Overview

Unleash the power of efficient logic gates with the NLV74HC03ADTR2G by Onsemi. Crafted with precision and quality, this product offers seamless performance in a variety of applications. With a focus on reliability and innovation, Onsemi delivers a product that provides unparalleled value and benefits to customers. From its fast propagation delay to its high durability, this logic gate is a game-changer in the industry. Elevate your projects with the NLV74HC03ADTR2G and experience the difference of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 36 ns

Fast signal propagation ensures efficient operation and response time for the logic gates.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying the assembly process.

No. of Functions: 4

Offers versatility and flexibility in designing complex logic circuits with multiple functions.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently within the common 5V supply range, compatible with standard electronic systems.

Technical Specifications

Logic Gates NLV74HC03ADTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

180 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC03ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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