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NLV74HCT573ADWRG

Onsemi

NLV74HCT573ADWRG by Onsemi

NLV74HCT573ADWRG by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a supply voltage range of 4.5V to 5.5V. It features a propagation delay of 45ns and can withstand temperatures from -55 °C to 125°C. Ideal for military-grade applications requiring reliable data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,080 parts In-Stock

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Digiode

USA . 1,779 parts In-Stock

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Microchip USA

USA . 3,473 parts In-Stock

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$2.370

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$2.370

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AZTECH Wire

Italy . 480 parts In-Stock

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$16.740

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$38.278

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$34.833

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$31.388

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$38.278

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$31.388

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Kulean Microsystems

USA . 5,747 parts In-Stock

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SupplyDigital Components

Austria . 5,433 parts In-Stock

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TANS Electronics

Latvia . 2,757 parts In-Stock

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Corphita

USA . 1,228 parts In-Stock

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Problanco Electronics

Mexico . 1,213 parts In-Stock

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UHIMA Technologies

Türkiye . 764 parts In-Stock

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Vigor

Singapore . 528 parts In-Stock

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Corohmni

South Africa . 118 parts In-Stock

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Overview

Unleash the power of seamless data transfer with the NLV74HCT573ADWRG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. Ideal for bus driver & transceiver applications, this product offers fast and efficient performance with its 8-bit design and true output polarity. With a small outline package style, dual terminal position, and military-grade temperature rating, the NLV74HCT573ADWRG is a versatile solution for all your electronic needs. Experience the value and benefits of this high-quality component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with a wide range of systems.

Propogation Delay (tpd): 45 ns

With a low propagation delay, this product ensures fast and efficient data transmission.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows for flexibility in controlling the logic levels, enhancing the versatility of the product.

Temperature Grade: MILITARY

Designed to operate in military-grade temperature ranges, this product is suitable for rugged applications and harsh environments.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers NLV74HCT573ADWRG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

45 ns

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLV74HCT573ADWRG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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