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NLV74HC373ADWR2G

Onsemi

NLV74HC373ADWR2G by Onsemi

NLV74HC373ADWR2G by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage range of 2-6V and has a propagation delay of 210ns. Ideal for applications requiring true output polarity, such as military-grade systems with temperature requirements ranging from -55 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,826 parts In-Stock

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Digiode

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Vigor

Singapore . 749 parts In-Stock

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$0.370

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$10.389

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$9.454

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$8.519

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AZTECH Wire

Italy . 1,051 parts In-Stock

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Kulean Microsystems

USA . 6,930 parts In-Stock

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SupplyDigital Components

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QUARKTWIN TECHNOLOGY LTD

USA . 6,111 parts In-Stock

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Microchip USA

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Corphita

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TANS Electronics

Latvia . 2,154 parts In-Stock

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Problanco Electronics

Mexico . 1,072 parts In-Stock

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Corohmni

South Africa . 453 parts In-Stock

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UHIMA Technologies

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Overview

Experience the unmatched quality and reliability of Onsemi with the NLV74HC373ADWR2G, a versatile Bus Driver & Transceiver ideal for a wide range of applications. With a compact package style and advanced CMOS technology, this product offers fast propagation delay and 3-STATE output characteristics, ensuring optimal performance in military-grade environments. From true output polarity to dual terminal position, this component provides exceptional value and benefits for your projects, making it the perfect choice for demanding applications where precision and efficiency are key. Trust Onsemi for superior solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver and transceiver.

Surface Mount: YES

Enables easy and secure installation on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently with a common voltage supply, making it compatible with a wide range of systems.

No. of Terminals: 20

Offers multiple connection points for interfacing with other components and external devices.

Propagation Delay (tpd): 210 ns

Ensures fast signal processing and transmission, ideal for high-speed data communication.

Maximum Operating Temperature: 125 °C

Can operate in harsh environments with elevated temperatures, suitable for industrial applications.

Output Characteristics: 3-STATE

Allows the driver/transceiver to switch between high impedance and active states, enhancing flexibility in signal routing.

Technology: CMOS

Utilizes low power consumption and offers high noise immunity, ensuring reliable performance while conserving energy.

Technical Specifications

Bus Driver & Transceivers NLV74HC373ADWR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

210 ns

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLV74HC373ADWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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