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NLV74HC00ADR2G

Onsemi

NLV74HC00ADR2G by Onsemi

NLV74HC00ADR2G by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 55 ns propagation delay. It operates at -55 to 125 °C and has a max supply voltage of 6 V. Ideal for military-grade applications requiring fast signal processing in compact designs.

Median Price

$0.168

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,387 parts In-Stock

1+ parts

-

100+ parts

$0.175

1k+ parts

$0.145

10k+ parts

$0.130

2,387

-

$0.175

$0.145

$0.130

Verical

USA . 2,387 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.162

2,387

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-

-

$0.162

Distributors (In-Stock)

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Digiode

USA . 1,769 parts In-Stock

1+ parts

$0.137

100+ parts

-

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1,769

$0.137

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Vyrian

USA . 7,393 parts In-Stock

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7,393

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,011 parts In-Stock

1+ parts

$0.130

100+ parts

-

1k+ parts

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1,011

$0.130

-

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Corohmni

South Africa . 57 parts In-Stock

1+ parts

$0.144

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57

$0.144

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Vigor

Singapore . 149 parts In-Stock

1+ parts

$0.230

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149

$0.230

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AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$20.710

100+ parts

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418

$20.710

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Component Stockers USA

USA . 315 parts In-Stock

1+ parts

$99.990

100+ parts

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315

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 25,693 parts In-Stock

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25,693

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Kulean Microsystems

USA . 6,910 parts In-Stock

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6,910

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TANS Electronics

Latvia . 5,698 parts In-Stock

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5,698

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Microchip USA

USA . 5,573 parts In-Stock

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5,573

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Problanco Electronics

Mexico . 4,817 parts In-Stock

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4,817

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SupplyDigital Components

Austria . 2,405 parts In-Stock

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2,405

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UHIMA Technologies

Türkiye . 8 parts In-Stock

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Overview

Enhance your electronic projects with the NLV74HC00ADR2G from Onsemi, a leading manufacturer known for top-quality logic gates. Perfect for a wide range of applications, this versatile component offers customers unmatched reliability and performance. With its fast propagation delay and low power consumption, this product ensures seamless operation and efficiency. Trust Onsemi for premium products that deliver exceptional value and benefits to meet all your circuit design needs. Experience the difference with the NLV74HC00ADR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 55 ns

With a low propagation delay, this product ensures fast and efficient operation in digital circuits, improving overall system performance.

Surface Mount: YES

Being surface mountable simplifies the manufacturing process and allows for higher component density on circuit boards, saving space.

No. of Functions: 4

Having multiple functions in a single component reduces the need for additional chips, leading to cost savings and simplifying circuit design.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures that the product meets stringent automotive quality standards, making it suitable for automotive applications.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations, making the product versatile and suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard digital systems, ensuring easy integration.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable and reliable operation in different circuit configurations, making the product versatile and compatible.

Power Supplies (V): 2/6

Supporting power supplies of 2V to 6V gives flexibility in voltage requirements, allowing the product to be used in a variety of systems.

No. of Terminals: 14

Having 14 terminals provides sufficient connectivity options, enabling the product to interface with other components easily.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making the product suitable for compact designs and applications with size constraints.

Maximum I (ol): 5.2 Amp

The high maximum output current capacity allows the product to drive power-hungry loads without the need for additional buffer amplifiers.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125 °C ensures reliable performance in harsh environments and high-temperature applications.

Minimum Operating Temperature: -55 °C

Being able to operate at temperatures as low as -55 °C makes the product suitable for use in extreme cold conditions or industrial freezers.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a reliable and corrosion-resistant connection, ensuring long-term performance and stability.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in mounting options, making the product adaptable to different PCB layouts and designs.

Maximum Seated Height: 1.75 mm

With a low seated height, the product is suitable for slim and compact devices where space is limited.

Width: 3.9 mm

The compact width of 3.9mm allows for high component density on the PCB, enabling more functionalities in a small footprint.

Minimum Supply Voltage (Vsup): 2 V

Supporting a minimum supply voltage of 2V ensures operational efficiency even in low-power applications and extends the product's range of use.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature of 30 seconds ensures proper soldering and assembly of the product, leading to reliable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows for high-temperature soldering processes, ensuring secure and durable connections on the PCB.

Length: 8.65 mm

At a length of 8.65mm, the product offers a balanced form factor suitable for various applications without compromising on functionality.

Temperature Grade: MILITARY

Having a military-grade temperature classification means the product meets strict quality and reliability standards, making it suitable for demanding environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making the product efficient and versatile.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability during soldering and assembly, ensuring a strong and reliable connection to the PCB.

Packing Method: TR

The TR packing method ensures secure transportation and storage of the product, reducing the risk of damage or mishandling during shipping.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the product offers compatibility with standard PCB layouts and designs, simplifying integration and assembly.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6V allows the product to handle higher voltage requirements, ensuring versatility and compatibility with different systems.

Technical Specifications

Logic Gates NLV74HC00ADR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

55 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74HC00ADR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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