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NLV14050BDTG

Onsemi

NLV14050BDTG by Onsemi

NLV14050BDTG by Onsemi is a CMOS Logic Gates IC with 6 functions, 140ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and has a load capacitance of 50pF. Ideal for military applications due to AEC-Q100 screening level.

Median Price

$0.322

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,404 parts In-Stock

1+ parts

-

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$0.308

1k+ parts

$0.256

10k+ parts

$0.228

1,404

-

$0.308

$0.256

$0.228

Verical

USA . 1,404 parts In-Stock

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$0.335

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$0.335

Distributors (In-Stock)

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Digiode

USA . 102 parts In-Stock

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$0.252

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102

$0.252

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Vyrian

USA . 13,283 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,065 parts In-Stock

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$0.211

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$0.211

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Corphita

USA . 163 parts In-Stock

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$0.238

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163

$0.238

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Corohmni

South Africa . 422 parts In-Stock

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$0.248

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422

$0.248

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Vigor

Singapore . 675 parts In-Stock

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$0.250

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675

$0.250

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AZTECH Wire

Italy . 589 parts In-Stock

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$13.840

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589

$13.840

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SupplyDigital Components

Austria . 8,036 parts In-Stock

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Problanco Electronics

Mexico . 6,180 parts In-Stock

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Kulean Microsystems

USA . 1,578 parts In-Stock

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TANS Electronics

Latvia . 1,468 parts In-Stock

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Continental Prestige Electronics

USA . 1,404 parts In-Stock

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$0.229

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$0.229

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UHIMA Technologies

Türkiye . 772 parts In-Stock

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Microchip USA

USA . 280 parts In-Stock

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Overview

Experience the cutting-edge technology of Onsemi with the NLV14050BDTG Logic Gates. Designed for high-performance applications, this product offers unparalleled quality and reliability. Whether you're in automotive, industrial, or consumer electronics, this versatile component provides fast propagation delay and low power consumption. Trust Onsemi's expertise to deliver top-notch solutions that exceed your expectations. Choose the NLV14050BDTG for exceptional value and performance that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and reliability for the package, ensuring the product can withstand various environmental conditions.

Propagation Delay At Nominal Supply: 140 ns

Low propagation delay ensures fast signal processing and high-speed performance in logic gate operations.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage makes it compatible with commonly used electronic systems and components.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance even in harsh temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noise-prone environments.

Technical Specifications

Logic Gates NLV14050BDTG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

140 ns

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV14050BDTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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