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NLU1GU04CMX1TCG

Onsemi

NLU1GU04CMX1TCG by Onsemi

NLU1GU04CMX1TCG by Onsemi is a CMOS Logic Gate with 15.5 ns Propagation Delay, suitable for military applications. It operates at a supply voltage range of 1.65V to 5.5V and can handle a load capacitance of 50 pF. This surface-mount device has a small outline package style and dual terminal position, making it ideal for compact electronic designs.

Median Price

$0.114

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 53,438 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

53,438

-

$0.119

$0.099

$0.088

Verical

USA . 53,438 parts In-Stock

1+ parts

-

100+ parts

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$0.110

53,438

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-

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$0.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,024 parts In-Stock

1+ parts

$0.093

100+ parts

-

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1,024

$0.093

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Vyrian

USA . 5,782 parts In-Stock

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5,782

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Distributors (Availability)

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Ampacity Inc.

Singapore . 52,971 parts In-Stock

1+ parts

$0.083

100+ parts

-

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52,971

$0.083

-

-

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Corphita

USA . 781 parts In-Stock

1+ parts

$0.088

100+ parts

-

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781

$0.088

-

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Vigor

Singapore . 432 parts In-Stock

1+ parts

$0.090

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432

$0.090

-

-

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Corohmni

South Africa . 79 parts In-Stock

1+ parts

$0.098

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-

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79

$0.098

-

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Component Stockers USA

USA . 69,488 parts In-Stock

1+ parts

$0.100

100+ parts

$0.090

1k+ parts

$0.090

10k+ parts

$0.090

69,488

$0.100

$0.090

$0.090

$0.090

AZTECH Wire

Italy . 248 parts In-Stock

1+ parts

$11.040

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248

$11.040

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Continental Prestige Electronics

USA . 53,438 parts In-Stock

1+ parts

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$0.085

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53,438

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$0.085

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Problanco Electronics

Mexico . 6,010 parts In-Stock

1+ parts

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6,010

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TANS Electronics

Latvia . 4,040 parts In-Stock

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4,040

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SupplyDigital Components

Austria . 3,251 parts In-Stock

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3,251

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Kulean Microsystems

USA . 869 parts In-Stock

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869

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UHIMA Technologies

Türkiye . 589 parts In-Stock

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589

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Microchip USA

USA . 375 parts In-Stock

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375

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Perfect Parts

USA . 56 parts In-Stock

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56

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Overview

Enhance your electronic projects with the NLU1GU04CMX1TCG by Onsemi, a high-quality logic gate that delivers reliable performance and precision. Manufactured by Onsemi, a trusted leader in semiconductor technology, this compact square-shaped package offers fast propagation delay and low power consumption at a nominal supply voltage of 5V. Ideal for military-grade applications, this logic gate is surface mountable and features a dual terminal position for easy installation. Elevate your designs with the efficiency and durability of the NLU1GU04CMX1TCG, providing exceptional value and functionality to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 15.5 ns

The low propagation delay ensures fast signal processing, making the product efficient for applications requiring quick response times.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides a standard power source that is commonly used in many electronic devices, ensuring compatibility with various systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and improving overall performance efficiency of the product.

Power Supplies (V): 1.8/5

The availability of multiple power supply options (1.8V and 5V) offers flexibility in compatibility with different voltage requirements of diverse electronic systems.

No. of Terminals: 6

The 6 terminals provide ample connectivity options, allowing for versatile integration of the product into various circuit configurations.

Maximum I (ol): 4 Amp

The high maximum output current of 4 Amps enables the product to drive power-hungry components effectively, enhancing its performance capabilities.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable operation even in harsh environmental conditions, increasing the product's durability and longevity.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows the product to function effectively in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring stable and long-lasting electrical connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit board layout and ensures secure mounting of the product, enhancing reliability and ease of use.

Maximum Seated Height: 0.4 mm

The low maximum seated height of 0.4 mm allows for compact integration of the product into tight spaces, making it suitable for applications with limited room for components.

Width: 1 mm

The small width of 1 mm enables space-efficient placement of the product on circuit boards, supporting compact design layouts and enhancing overall system efficiency.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage of 1.65V ensures compatibility with low-power applications and allows for efficient operation with minimal energy consumption.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable soldering during the assembly process, contributing to the product's durability and performance consistency.

Length: 1 mm

The small length of 1 mm contributes to the compact size of the product, making it suitable for applications where space is limited and component density is crucial.

Temperature Grade: MILITARY

The military-grade temperature rating indicates that the product meets stringent quality and reliability standards, making it suitable for demanding applications that require high performance in extreme conditions.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and fast switching speeds, making it a reliable and efficient choice for various digital applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and supports environmentally friendly manufacturing practices, ensuring the product's compliance with regulatory standards.

Packing Method: TR

The TR packing method provides secure packaging and easy handling of the product, simplifying storage, transportation, and integration into electronic systems.

Terminal Pitch: 0.35 mm

The small terminal pitch of 0.35 mm allows for high-density mounting of the product on circuit boards, enabling efficient use of space and supporting complex circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in powering the product and ensures compatibility with systems that require higher voltage levels for optimal performance.

Technical Specifications

Logic Gates NLU1GU04CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

15.5 ns

Propagation Delay (tpd):

15.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU1GU04CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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