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NLU1G08CMUTCG

Onsemi

NLU1G08CMUTCG by Onsemi

NLU1G08CMUTCG by Onsemi is a logic gate with 2 inputs and a propagation delay of 16.5 ns. It operates at a nominal voltage of 5V and is suitable for military applications due to its temperature grade.

Median Price

$0.108

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 101,109 parts In-Stock

1+ parts

-

100+ parts

$0.112

1k+ parts

$0.093

10k+ parts

$0.083

101,109

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$0.112

$0.093

$0.083

DigiKey

USA . 101,109 parts In-Stock

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$0.140

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$0.140

Verical

USA . 101,109 parts In-Stock

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$0.104

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$0.104

Mouser Electronics

USA . 900 parts In-Stock

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$0.088

900

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$0.088

Distributors (In-Stock)

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Digiode

USA . 1,818 parts In-Stock

1+ parts

$0.091

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1,818

$0.091

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Nova Conductors

Japan . 44 parts In-Stock

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$0.107

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44

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Vyrian

USA . 68,238 parts In-Stock

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Chip Stock

USA . 45,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 68,552 parts In-Stock

1+ parts

$0.075

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68,552

$0.075

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Semicontronic

India . 68,232 parts In-Stock

1+ parts

$0.075

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$0.073

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$0.073

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68,232

$0.075

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$0.073

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Corphita

USA . 2,475 parts In-Stock

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$0.086

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Corohmni

South Africa . 189 parts In-Stock

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$0.088

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Continental Prestige Electronics

USA . 5,199 parts In-Stock

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$0.107

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$0.105

5,199

$0.107

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Argo Parts USA

USA . 1,743 parts In-Stock

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$0.107

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1,743

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Netroflash

USA . 500 parts In-Stock

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$0.107

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$0.102

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$0.100

500

$0.107

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$0.102

$0.100

Aztec Data Supply Inc.

USA . 1,783 parts In-Stock

1+ parts

$10.950

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1,783

$10.950

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SupplyDigital Components

Austria . 8,003 parts In-Stock

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Problanco Electronics

Mexico . 7,082 parts In-Stock

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Kulean Microsystems

USA . 4,986 parts In-Stock

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Microchip USA

USA . 1,718 parts In-Stock

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TANS Electronics

Latvia . 1,655 parts In-Stock

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UHIMA Technologies

Türkiye . 738 parts In-Stock

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738

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Overview

Discover the NLU1G08CMUTCG by Onsemi, an exceptional logic gate that delivers unmatched quality and performance. Manufactured by Onsemi, a renowned industry leader, this logic gate offers a wide range of applications and benefits. With its compact design and surface mount capability, it provides ease of use and versatility. Boasting a low propagation delay and a nominal supply voltage of 5V, this product ensures optimal performance and efficiency. Whether you're looking to enhance your electronic projects or streamline your circuit designs, the NLU1G08CMUTCG is the perfect choice. Unlock the potential of your creations with this remarkable logic gate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the logic gates, ensuring they can withstand various environmental conditions. This makes the product a reliable choice for long-term usage.

Propagation Delay At Nominal Supply: 16.5 ns

With a propagation delay of only 16.5 ns, this product offers fast response times, allowing for efficient processing of signals. This makes it suitable for high-speed applications where timing is critical.

Surface Mount: YES

The surface mount capability of these logic gates allows for easy and convenient installation on circuit boards. This feature simplifies the assembly process and makes these gates compatible with modern electronics.

No. of Functions: 1

With a single function, this product provides a straightforward and specific solution for implementing logic operations. It eliminates any unnecessary complexity, making it an efficient choice for simple circuit designs.

No. of Inputs: 2

The two inputs of these logic gates provide flexibility in processing multiple input signals simultaneously. This enables the implementation of various logic functions, making the product versatile for a wide range of applications.

Package Shape: SQUARE

The square package shape optimizes space utilization on circuit boards, allowing for compact designs in electronic devices. This makes these logic gates suitable for applications with limited board real estate.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, these logic gates are compatible with standard power supply sources commonly found in electronic systems. This makes them easily integrable into existing circuits.

Load Capacitance (CL): 50 pF

The load capacitance value of 50pF indicates the maximum capacitance that these logic gates can drive without experiencing significant signal degradation. This feature ensures stable and reliable operation, making the product an ideal choice for driving capacitive loads.

Power Supplies (V): 1.8/5

With multiple power supply options (1.8V and 5V), these logic gates offer compatibility with a wide range of systems. This flexibility allows for their seamless integration into various electronic applications.

No. of Terminals: 6

The six terminals provide convenient connection points for input and output signals, simplifying the integration of these logic gates into larger circuitry. This feature enhances ease-of-use and facilitates the overall system design process.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and very thin profile of the package style minimize space requirements, making it suitable for compact electronic devices. This makes the product ideal for applications that demand miniaturized components.

Maximum I (ol): 4 Amp

With a maximum sink current of 4 Amps, these logic gates can handle significant loads without experiencing performance issues. This capability makes them suitable for driving power-hungry devices or circuits.

Propagation Delay (tpd): 16.5 ns

The propagation delay of 16.5 ns ensures that these logic gates deliver fast and efficient signal processing. This feature is valuable for applications requiring quick response times, enabling seamless operation in time-sensitive systems.

Maximum Operating Temperature: 125 °C

The maximum operating temperature of 125°C allows these logic gates to operate reliably in high-temperature environments. This feature makes the product suitable for industrial or automotive applications that experience elevated temperatures.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, these logic gates can withstand extremely cold conditions. This characteristic ensures reliable operation in low-temperature environments, making them suitable for outdoor or aerospace applications.

Terminal Finish: NICKEL GOLD PALLADIUM

The nickel-gold-palladium terminal finish of these logic gates enhances their corrosion resistance and provides superior electrical conductivity. This feature ensures long-term reliability, making the product suitable for demanding environments.

Terminal Position: DUAL

The dual-terminal position allows for flexibility in connecting the logic gates, ensuring easy integration into various circuit designs. This feature simplifies installation and enhances compatibility, making the product versatile for different configurations.

Maximum Seated Height: 0.55 mm

With a maximum seated height of only 0.55 mm, these logic gates minimize the vertical space required on circuit boards. This makes them suitable for ultra-thin or compact electronic devices, enabling sleek and slim designs.

Width: 1 mm

With a width of 1 mm, these logic gates occupy minimal space on circuit boards. This compact size allows for more components to be packed into a limited area, making them a practical choice for densely populated PCB layouts.

Minimum Supply Voltage (Vsup): 1.65 V

With a minimum supply voltage requirement of 1.65V, these logic gates can operate efficiently even with low power sources. This feature enables energy-efficient designs and extends battery life in portable electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and bonding during assembly processes. This feature enhances the product's manufacturability and reliability, making it suitable for mass production.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, these logic gates can withstand high-temperature soldering processes without degrading their performance. This feature ensures the product's robustness during manufacturing, allowing for efficient assembly operations.

Length: 1 mm

The 1 mm length of these logic gates contributes to their compact form factor, allowing for space-saving designs in electronic systems. This aspect makes the product a suitable choice for applications with limited board real estate.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that these logic gates can withstand harsh operating conditions and temperature extremes. This feature makes them suitable for defense, aerospace, and other rugged applications that demand high reliability.

Technology: CMOS

The CMOS (Complementary Metal-Oxide-Semiconductor) technology utilized in these logic gates offers low power consumption and high noise immunity. This technological advantage makes them energy-efficient, reliable, and suitable for a wide range of electronics applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the need for traditional leaded solder connections, enhancing the product's environmental friendliness. This feature complies with modern RoHS (Restriction of Hazardous Substances) regulations, making the product a sustainable choice.

Packing Method: TR

The TR (Tape and Reel) packing method ensures convenient handling and storage of these logic gates during the manufacturing process. This feature simplifies production line integration and facilitates automated assembly, allowing for efficient manufacturing workflows.

Terminal Pitch: 0.35 mm

With a terminal pitch of 0.35 mm, these logic gates offer fine pitch connections for enhanced signal integrity. This feature enables high-density circuit designs and ensures reliable electrical performance, making the product suitable for advanced electronic applications.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level 1 rating of these logic gates indicates their resistance to moisture absorption during storage and usage. This feature enhances their stability and longevity, making the product a reliable choice for diverse environmental conditions.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, these logic gates can tolerate momentary voltage spikes without compromising their performance. This feature provides surge protection and ensures the product's resilience, making it suitable for environments with potential voltage fluctuations.

Technical Specifications

Logic Gates NLU1G08CMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

16.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLU1G08CMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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